Sandisk

Technology

SeniorEngineer,PackagingEngineering

₹22–35L ~AI est. Bengaluru, Karnataka, India FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for mid candidates.

The Brief

“Senior Engineer, Packaging Engineering at Sandisk. Skills: Semiconductor packaging, Flash memory, Package lifecycle. Represent Package Engineering. Characterize packages”

What You'll Achieve.

Meet mechanical requirements; Meet electrical requirements; Meet performance requirements; Meet reliability requirements; Meet quality requirements; Yield meeting goals; Quality meeting goals

Industry & Context.

Technology

What They're Looking For.

Must Have

Masters in Material Science, Masters in Manufacturing, Masters in Mechanical Engineering, Masters in Packaging engineering, Masters in Physics, 1-2 years of relevant experience, Proficient in product management, Knowledge of material properties, Familiarity with statistical tools, Familiarity with failure analysis

Nice to Have

Knowledge of thermo-mechanical aspects

What You'll Do.

Represent Package Engineering

Characterize packages

Introduce packages into production

Lead cross-functional teams

Manage package lifecycle

Develop new packaging technology

Qualify new packaging technology

Support assembly yield improvement

Support package cost reduction

Lead new product transition

Ensure FMEA readiness

Ensure Control Plan readiness

Ensure recipe guideline readiness

Work on package design

How You'll Work.

Team & Collaboration

Cross-functional teams; Global functional teams

Process & Methodology

Product management

Full Job Description

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. We are seeking a highly skilled Senior Engineer, Packaging Engineering to join our team in Bengaluru, India. In this role, you will lead semiconductor packaging technology for flash memory products. * Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements. * Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process. * Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs * Support assembly yield improvement and package cost reduction programs. * Lead new product from low volume to high volume production transition with yield and quality meeting go

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