Sandisk
Semiconductor
SeniorEngineer,PackagingEngineering
Neural analysis suggests this role is
optimal for mid candidates.
“Senior Engineer, Packaging Engineering at Sandisk. Skills: Semiconductor packaging, Product management, Material science. Lead semiconductor packaging technology. Represent Package Engineering in cross-functional teams”
What You'll Achieve.
meeting all mechanical, electrical, performance, reliability, and quality requirements; meeting goals for yield and quality
Industry & Context.
What They're Looking For.
Must Have
Masters in Material Science, Manufacturing, Mechanical Engineering, Packaging engineering, Physics or relevant engineering disciplines, 1-2 years of relevant experience, Proficient in product management, Knowledge of material properties used in IC packaging, Familiarity with statistical tools, Familiarity with failure analysis approach
Nice to Have
Excellent written and communication skills, Knowledge of thermo-mechanical aspects of semiconductor packages, Knowledge in Machine learning, Knowledge in data analytics utilizing AI
What You'll Do.
Lead semiconductor packaging technology
Represent Package Engineering in cross-functional teams
Ensure packages are characterized
and introduced into production
Lead cross-functional teams
Manage the entire package life cycle process
Develop and qualify new packaging technology
Support assembly yield improvement
Support package cost reduction programs
Lead new product transition to production
Develop best-in-class package design
How You'll Work.
Team & Collaboration
Represents Package Engineering in cross-functional teams; Lead cross-functional teams, factories, and other engineers; Works with the Packaging R&D teams worldwide; collaboration with global functional teams
Communication Scope
Excellent written and communication skills
Process & Methodology
Manage the entire package life cycle process
Full Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. We are seeking a highly skilled Senior Engineer, Packaging Engineering to join our team in Bengaluru, India. In this role, you will lead semiconductor packaging technology for flash memory products. * Represents Package Engineering in cross-functional teams and ensures that packages are characterized, qualified, and introduced into production in a timely manner while meeting all mechanical, electrical, performance, reliability, and quality requirements. * Lead cross-functional teams, factories, and other engineers while managing the entire package life cycle process. * Works with the Packaging R&D teams worldwide to develop and qualify new and emerging packaging technology required to support business needs * Support assembly yield improvement and package cost reduction programs. * Lead new product from low volume to high volume production transition with yield and quality meeting go
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