ASM America Inc.
Semiconductor
SeniorEngineerI,SystemEngineering(SystemsandMechanicalEngineering–ElectrostaticChuck(ESC))
Neural analysis suggests this role is
optimal for Senior candidates.
“Senior Engineer I, System Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC)) at ASM America Inc.. Skills: Electrostatic Chuck (ESC), Heater assemblies, Ceramic materials, Thermal modeling. Design JR and Coulombic-type ESC assemblies. Select and qualify dielectric materials”
Industry & Context.
Analytical; Problem-solving; Systematic failure analysis
What They're Looking For.
Must Have
Master's degree or PhD, 3–5 years semiconductor capital equipment engineering, Direct exposure to ESC or heater technologies, Experience with 300mm wafer processing tools, OEM component qualification processes, Knowledge of high-purity ceramic fabrication, Familiarity with reactive process chemistries, Solid understanding of electrostatic clamping mechanisms, Experience with ceramic materials, Experience with thin-film dielectric systems, Familiarity with thermal management, Hands-on experience with electrical characterization, Knowledge of plasma processing systems, Experience with FEA thermal simulation tools, Analytical and problem-solving ability, Systematic approach to failure analysis, Effective communication skills, Ability to work in cross-functional teams
Nice to Have
Experience with ANSYS, COMSOL, or equivalent
What You'll Do.
Design JR and Coulombic-type ESC assemblies
Select and qualify dielectric materials
Define ESC clamping voltage specifications
Define ESC leakage current specifications
Define ESC chucking performance specifications
Define ESC dechucking performance specifications
Characterize ESC electrical properties
Analyze wafer backside contamination risks
Analyze particle generation risks
Support ESC integration with RF supplies
Support ESC integration with DC supplies
Design multi-zone embedded heater assemblies
Perform thermal modeling
Perform thermal simulation
Optimize heater layout
Optimize power density
Optimize zone configuration
Develop closed-loop temperature control systems
Validate closed-loop temperature control systems
Characterize heater uniformity
Characterize heater ramp rates
Characterize heater thermal response
Manage thermal stress
How You'll Work.
Team & Collaboration
Cross-functional teams
Full Job Description
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving. But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential. Reporting to the Expert System Engineering Manager, the Senior Engineer for Electrostatic Chuck (ESC) is accountable for the design, and delivery of hardware engineering solutions focused on ESC and heaters technology. The Engineer will be responsible for focusing on the development of highly innovative technologies over legacy solutions. Key Responsibilities Design and develop Johnsen-Rahbek (JR) and Coulombic-type ESC assemblies for 300mm wafer processing applications. Select and qualify dielectric materials (alumina, AlN, Y2O3) for ESC ceramic layers based on electrical, thermal, and chemical compatibility requirements. Define ESC clamping voltage, leakage current, and chucking/dechucking performance specifications. Characterize ESC electrical properties including volume resistivity, dielectric constant, and breakdown voltage across process temperature ranges. Analyze and mitigate wafer backside contamination, particle generation, and arcing risks associated with ESC operation. Support ESC integration with RF bias and DC chucking power supplies in plasma processing chambers. Design multi-zone embedded heater assemblies for uniform wafer temperature distribution across process temperatures (room temperature to 700°C+). Perform thermal modeling and simulation (FEA) to optimize heater layo
Applying for this Senior Engineer I, System Engineering (Systems and Mechanical Engineering – Electrostatic Chuck (ESC)) role?
Most applicants get filtered before a human reads their resume. See if yours makes the cut.
ANONYMOUS · UNFILTERED
What do employees actually say about ASM America Inc.?
Real rants from real employees. Read before you apply.