Nanyang Technological University
Education
ResearchFellow(SemiconductorAdvancedPackaging)
“Research Fellow (Semiconductor Advanced Packaging) at Nanyang Technological University. Skills: Semiconductor, Advanced Packaging, Hybrid Bonding, Process Development. Develop Cu–Cu hybrid bonding flow. Optimize process windows”
What You'll Achieve.
Deliver a manufacturable 3D-integration solution; Support NTU’s leadership in industry-relevant advanced packaging research
Industry & Context.
Process integration; Root-cause analysis; Failure analysis
What They're Looking For.
Must Have
PhD in Materials/ Microelectronics/ EEE/ or related, Hands-on semiconductor process development in cleanroom (Cu interconnect/wafer or hybrid litho/etch/CMP/plasma/anneal), Characterization: optical/profilometry, SEM/TEM, XPS/AFM, electrical, documentation, safety discipline, and clear communication in English, Process integration & root-cause/failure analysis, Reliability mindset (design/interpret thermal & electrical stress tests), Collaboration with tool vendors/industry concise ownership
Nice to Have
DoE/statistics (Python/Matlab a plus)
What You'll Do.
Develop Cu–Cu hybrid bonding flow
Optimize process windows
Characterize materials and interfaces
Validate reliability and scalability
Report and collaborate
Maintain documentation and compliance
How You'll Work.
Team & Collaboration
Coordinate with partners; Collaboration with tool vendors; Collaboration with industry
Communication Scope
Clear communication in English; Technical reporting; Technical presentations
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