ProgramLead

Program Lead **Description -** HP is looking for a **Program Lead** to join our global Reverse and Repair team. This role has significant impact on customer experience and Service P&L, leading technical process improvement initiatives across HP Indigo’s global Repair Centers, with a clear objective to increase yield, reduce scrap, and improve process robustness. _**Key responsibilities**_ * Lead structured, data‑driven initiatives to improve repair Yield and reduce Scrap across global Repair Centers. * Analyze repair performance trends, identify systemic loss drivers, and define targeted improvement actions. * Define and drive Yield improvement roadmaps by part family and technology, aligned with business priorities. * Lead end‑to‑end investigations for recurring failures, chronic low‑yield parts, and abnormal scrap trends. * Drive structured root cause analysis (A3 / 8D / RCA) at component, assembly, and process levels, distinguishing between design, process, handling, installation, and logistics causes. * Identify non‑robust repair and installation steps and drive process simplification and mistake‑proofing. * Improve repair procedures, work instructions, verification steps, and embedded control points to eliminate repeated failures. * Build dashboards and structured reporting to track trends, root causes, and improvement effectiveness, translating data into clear management insights. * Drive cross‑functional alignment with Repair Centers, Quality, R&D, Spare Parts Organization, and Suppliers, leading cross‑site task forces and ensuring corrective actions are implemented, validated, standardized, and sustained. _**Education, Skills, and experience**_ * B.SC in Mechanical Engineering, Electrical Engineering, or equivalent. * 4-6 years in engineering, technical services, or manufacturing technologies – **must.** * Fluent in English (reading, writing, speaking) – **must**. * Very strong technical background with Spare Parts repair/refurbish – **advantage.** * Hands-o