Micron Technology

Technology

ProductYieldEnhancement(PYE)Engineer

$1300–1950k ~AI est. Taichung, Taiwan FULL TIME
The Brief

“Product Yield Enhancement (PYE) Engineer at Micron Technology. Skills: Failure Analysis, Electrical Characterization, Physical Characterization, Data Analysis. Perform Electrical Failure Analysis. Perform Fault Isolation”

What You'll Achieve.

Enhanced product reliability; Rapid production ramp; Early time to market

Industry & Context.

Technology
Problems you'll solve

Problem-solving skills; Analytical skills

What They're Looking For.

Must Have

Bachelor’s Degree in Electrical or Electronics Engineering, Electro-Optical Engineering, Photonics, Microelectronics, and Semiconductor Technology, Extensive understanding of physical and logical semi-conductor design, Understand various PFA and de-processing techniques, In depth understanding of CMOS process fabrication levels, Knowledge of package assembly flow, Understand reliability concerns, Expertise with process and assembly related defects, Understand probe, backend test and qualification flows, Computer aided layout and schematic experience, Semiconductor process coursework and/or experience, UNIX and Programming experience, Experience working in teams, Ability to work well with others

Nice to Have

Course work in VLSI design, Course work in semiconductor device physics

What You'll Do.

Perform Electrical Failure Analysis

Perform Fault Isolation

Operate uMate bench test platform

Operate Hamamatsu iPHEMOS

Operate Thermo Fisher ELITE

Operate photon stimulating emission tools

Operate thermal stimulating emission tools

Operate laser stimulating emission tools

Characterize backend test fail signatures

Model backend test fail signatures

Characterize internal qualification fail signatures

Model internal qualification fail signatures

Characterize RMA fail signatures

Model RMA fail signatures

Use layout/schematic for fault isolation

Use layout/schematic for fail signature modeling

Understand Fabrication Process

Understand Package Assembly

Provide Clear Fail Signature Information

Provide Comprehensive Fail Signature Information

Generate failure analysis reports

Perform fab data extractions

Perform probe data extractions

Perform backend data extractions

How You'll Work.

Team & Collaboration

Communicate failure analysis findings; Coordinate failure analysis findings

Communication Scope

Good communication skills

Free ATS check

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