Micron Technology
Technology
ProductYieldEnhancement(PYE)Engineer
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Product Yield Enhancement (PYE) Engineer at Micron Technology. Skills: Failure Analysis, Electrical Characterization, Physical Characterization, Data Analysis. Perform Electrical Failure Analysis. Perform Fault Isolation”
What You'll Achieve.
Enhanced product reliability; Rapid production ramp; Early time to market
Industry & Context.
Problem-solving skills; Analytical skills
What They're Looking For.
Must Have
Bachelor’s Degree in Electrical or Electronics Engineering, Electro-Optical Engineering, Photonics, Microelectronics, and Semiconductor Technology, Extensive understanding of physical and logical semi-conductor design, Understand various PFA and de-processing techniques, In depth understanding of CMOS process fabrication levels, Knowledge of package assembly flow, Understand reliability concerns, Expertise with process and assembly related defects, Understand probe, backend test and qualification flows, Computer aided layout and schematic experience, Semiconductor process coursework and/or experience, UNIX and Programming experience, Experience working in teams, Ability to work well with others
Nice to Have
Course work in VLSI design, Course work in semiconductor device physics
What You'll Do.
Perform Electrical Failure Analysis
Perform Fault Isolation
Operate uMate bench test platform
Operate Hamamatsu iPHEMOS
Operate Thermo Fisher ELITE
Operate photon stimulating emission tools
Operate thermal stimulating emission tools
Operate laser stimulating emission tools
Characterize backend test fail signatures
Model backend test fail signatures
Characterize internal qualification fail signatures
Model internal qualification fail signatures
Characterize RMA fail signatures
Model RMA fail signatures
Use layout/schematic for fault isolation
Use layout/schematic for fail signature modeling
Understand Fabrication Process
Understand Package Assembly
Provide Clear Fail Signature Information
Provide Comprehensive Fail Signature Information
Generate failure analysis reports
Perform fab data extractions
Perform probe data extractions
Perform backend data extractions
How You'll Work.
Team & Collaboration
Communicate failure analysis findings; Coordinate failure analysis findings
Communication Scope
Good communication skills
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Yield Enhancement (PYE) Engineer for Micron Technology, Inc., you will work with a team responsible for taking next generation devices from design to mass production. You will focus on failure analysis of test, internal qualification, and RMA failures, allowing for enhanced product reliability, rapid production ramp and early time to market. Your primary areas of responsibility will utilize fault isolation with a combination of electrical and physical characterization techniques combined with data analysis to identify physical defects introduced by process level or assembly step. Additionally, you will be responsible for communicating and coordinating failure analysis findings with Management, Product, Process, Assembly and Quality Assurance groups. **The general responsibilities of the position are the following:** * _Perform Electrical Failure Analysis and Fault Isolation_ * Operate uMate bench test platform * _**Operate Hamamatsu iPHEMOS, Thermo Fisher ELITE and other photon, thermal, or laser stimulating emission tools**_ * Characterize or model backend test, internal qualification, and RMA fail signatures * Extensive understanding of physical and logical semi-conductor design * Use layout/schematic to aid in fault isolation and fail signature modeling * Understand various PFA and de-processing techniques for failures * _Understanding Fabrication Process and Package Assembly_ * In depth understanding of CMOS process fabrication levels, steps, and methodologies * Knowledge of the steps and details involved in the package assembly flow * Understand reliability concerns that can cause delayed breakdown fail signatures * Extensive expertise with pro
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