Nxp In Greater China
ProcessIntegrationDeviceEngineer
Neural analysis suggests this role is
optimal for Senior candidates.
“Process Integration Device Engineer at Nxp In Greater China. Skills: Process Integration, Device Engineering, Technology Transfer. Lead technology development. Integrate HVCD semiconductor technologies”
What You'll Achieve.
Ensure process integration meets requirements; Ensure device performance meets requirements; Ensure reliability meets requirements; Align foundry implementations with NXP standards; Accelerate development cycles; Support NXP business roadmaps; Support product roadmaps
Industry & Context.
diagnose complex process and device issues
What They're Looking For.
Must Have
Master's or Ph. D. in Electrical Engineering, Solid-State Physics, or Materials Science, 10+ years of semiconductor industry experience in process integration or device engineering, Profound knowledge of HV and BCD technologies, experience in technology development and/or transfer projects with foundries, Fluent in English, Mandarin proficiency
Nice to Have
familiarity with JMP and Cadence is a plus, TCAD (2D/3D) simulations
What You'll Do.
Lead technology development
Integrate HVCD semiconductor technologies
Transfer HVCD semiconductor technologies
Define technical review foundry implementations
Analyze process integration deviations
Propose corrective solutions
Lead device architecture development
Optimize device architecture
Analyze device physics parameters
Support device verification
How You'll Work.
Team & Collaboration
Collaborate with internal Business, Design, Design Enablement, PI, and PE teams; Serve as primary technical interface to foundries; Lead technical discussions with foundries; Drive technical decision-making with foundries
Communication Scope
ability to communicate technical concepts
Process & Methodology
Drive projects to timely completion
Full Job Description
**Responsibilities:** **Role Purpose** Lead the development, integration, and transfer of HV/BCD semiconductor technologies, serving as the key technical interface between NXP and external foundries in China. This role ensures that process integration, device performance, and reliability fully meet NXP product and business requirements through strong device physics expertise and cross-functional leadership. **Process Integration & Technology Transfer** * Act as a Process Integration / Device Engineer in HV and BCD technology development and transfer projects. * Ensure external foundries correctly understand and implement NXP technology and device requirements. * Define and communicate technical specifications; review foundry implementations and assess alignment with NXP needs. * Analyze process integration deviations and their impact on performance, yield, and reliability. * Propose and drive corrective solutions to align foundry implementations with NXP standards. **Device & Physics Leadership** * Lead or strongly contribute to HV/BCD device architecture development and optimization (LDMOS, EDMOS, ESD). * Analyze key device physics parameters including breakdown voltage (BV), Rdson, SOA, and reliability. * Utilize TCAD (2D/3D) simulations to accelerate development cycles and root-cause analysis. * Support device verification through statistical analysis of DOE and WAT data. **Cross-functional & External Collaboration** * Collaborate closely with internal Business, Design, Design Enablement, PI, and PE teams. * Serve as the primary technical interface to foundries in China, leading technical discussions and decision-making. * Drive projects to timely completion in support of NXP business and product roadmaps. **Requirements:** **Required Qualifications** * Master’s or Ph.D. in Electrical Engineering, Solid-State Physics, or Materials Science. * 10+ years of semiconductor industry experience in process integration or device engineering. * Profound knowledge of HV and
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