Micron Technology
Semiconductor
PrincipalThinFilmsEngineer,AdvancedPackaging
Neural analysis suggests this role is
optimal for Senior candidates.
“Principal Thin Films Engineer, Advanced Packaging at Micron Technology. Skills: Thin film deposition, Advanced Packaging, Process optimization. Develop thin film processes. Optimize thin film processes”
Industry & Context.
Root cause analysis; Failure mode analysis; Creative problem-solving
Minimal travel
What They're Looking For.
Must Have
MS or PHD in Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields, 7+ years of industry experience in Advanced Packaging, Specialization in thin film deposition and characterization, Understanding of growth and characterization of thin films, Proficiency with data analysis, DOE, and statistical techniques, Knowledge of thermodynamics, chemical kinetics, Analytical and creative problem-solving skills, Extensive technical knowledge to guide decisions and strategies
Nice to Have
Experience with plasma processing, Experience in programming/scripting/automation, Creation or regular use of AI agents
What You'll Do.
Develop thin film processes
Optimize thin film processes
Characterize thin film processes
Collaborate with process integration teams
Collaborate with process development teams
Develop innovative solutions
Optimize deposition processes
Reduce process variability
Improve process capability
Conduct root cause analysis
Conduct failure mode analysis
Engage vendors for solutions
Maintain a technology development pilot manufacturing line
Support process transfer to production facilities
How You'll Work.
Team & Collaboration
Global R&D groups; Suppliers; Manufacturing teams; Process integration; Electrical failure analysis; Yield enhancement; Semiconductor equipment manufacturers
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Department Overview:** The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of ground breaking memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. **Position Overview:** We are seeking an experienced Process Engineer with expertise in depositing thin films who will thrive in a fast paced and results oriented environment! Our goal is to employ robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry-leading memory products. In this role, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems. You will to take ideas from conception through development and implementation in manufacturing. Best-qualified candidates will have deep subject matter expertise in Thin Films in semiconductor Advanced Packaging R&D roles. We offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing, and various semiconductor equipment manufacturers. You will have the opportunity to drive and define Micron’s thin film technology roadmaps, generating intellectual property which will have a direct influence on our global industry leadership. **Job Responsibilities:** * Develop, optimize, and characterize thin film processes to meet the requirements of pioneering advanced packaging products * Collaborate with process integration and other process d
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