PrincipalSoCDesignEngineer,HBM

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an **SoC Design Engineer** , you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet aggressive power, performance, area, and schedule targets. This is a hands‑on technical role focused on RTL design, IP integration, debug, and pre‑/post‑silicon support. **Key Responsibilities** * ### **Key Responsibilities** * Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. * Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). * Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. * Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. * Support design verification through debug of simulation, emulation, and formal results; resolve functional, performance, and connectivity issues. * Work closely with physical design teams to