Micron Technology

Technology

Principal/Senior/Engineer,DRAMReliability

$12000–18000k ~AI est. Hiroshima, Japan FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Principal / Senior / Engineer, DRAM Reliability at Micron Technology. Skills: DRAM Reliability, Device Physics, Semiconductor Devices. Analyze reliability performance. Build reliability models”

What You'll Achieve.

Deliver decision-ready recommendations; Deliver actionable recommendations

Industry & Context.

Technology
Problems you'll solve

Root cause analysis

What They're Looking For.

Must Have

3+ years industry/research experience, Semiconductor device physics understanding, DRAM/NAND/Emerging Memory knowledge, Statistical data analysis knowledge, Circuit operation basic knowledge, Semiconductor device parametric measurement skills, Semiconductor lab instrumentation operation experience, Semiconductor device process technology understanding

Nice to Have

Programming languages knowledge, Semiconductor device structure knowledge, Semiconductor process knowledge, Circuit operation understanding, DRAM product architecture understanding, Electrical analysis knowledge

What You'll Do.

Analyze reliability performance

Build reliability models

Consult on reliability

Develop test methodologies

Implement test methodologies

Evaluate reliability behavior

Evaluate reliability performance

Deliver recommendations

Guide technology development

Correlate reliability signature

Integrate data sources

Model physical understanding

Model decision quality

How You'll Work.

Team & Collaboration

DRAM device/process team; Circuit design team; Process Integration team; Characterization teams

Communication Scope

Communication skills

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Our vision is to transform how the world uses information to enrich life for** _**all**_**.** As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. **Responsibilities and Tasks:** * Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. * Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. * Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. * Integrate other data sources (inline metro, param, probe) and PFA analysis if need to model physical understanding and decision quality. * Reliability model building and consultation from process integration team and circuit design team **Requirements:** * Understanding semiconductor device physics. * Basi

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