Micron Technology
Technology
PrincipalProductYieldAnalysisEngineer
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“Principal Product Yield Analysis Engineer at Micron Technology. Skills: Product Yield Analysis, Failure Analysis, Root Cause Analysis, Semiconductor Yield. Perform electrical failure analysis. Perform physical failure analysis”
What You'll Achieve.
Achieve yield standards; Achieve quality standards; Enable rapid production ramp-up; Accelerate time-to-market
Industry & Context.
Root cause analysis; Failure analysis; Troubleshooting
Willingness to travel
What They're Looking For.
Must Have
BS, MS, or PhD in Electrical, Electronics, Photonics, Materials Science & Engineering, Applied Physics, Computer Engineering, or equivalent, 5+ years relevant semiconductor experience, Hands-on electrical failure analysis, Hands-on physical failure analysis, Hands-on optical fault isolation techniques, Proficiency in probe/backend test flows, Proficiency in fab data analysis methodologies, English communication skills
Nice to Have
Experience with advanced DRAM/HBM products, Experience with root cause analysis of 3D-integration/packaging technology, Familiarity with hybrid and 2.5D/3D EDA tools, Familiarity with computer-aided schematic/layout/net tracing and simulation, Background in sub-10nm process nodes, Background in semiconductor process coursework, Background in optical engineering coursework, Advanced programming skills, ML/AI experience applied to failure analysis or yield improvement, Proficiency in additional languages
What You'll Do.
Perform electrical failure analysis
Perform physical failure analysis
Perform optical fault isolation techniques
Replicate probe failures
Determine root cause of failures
Leverage EDA tools for circuit understanding
Leverage EDA tools for timing characterization
Leverage EDA tools for failure signature analysis
Explore automation solutions
Explore ML/AI solutions
Enhance root cause methodologies
Analyze SWRs/conversions/excursions
Correlate probe data with inline monitors
Correlate probe data with backend reliability data
Recommend corrective actions
Share lessons learned
Mentor remote FA teams
Provide 1st silicon support
Develop new FA techniques
Develop shift-left strategies
How You'll Work.
Team & Collaboration
Cross-functional departments; Remote and US sites; Remote FA teams
Communication Scope
Present technical findings
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Product Yield Analysis (PYA) Engineer at Micron, you will work with teams responsible for driving the advancement of next-generation devices and technology nodes, including HBM, from design to mature yield levels prior to transferring products to mass production. Your primary focus will be resolving complex issues that impact test yield and overall product reliability during product introduction, with the objective of achieving yield and quality standards that enable rapid production ramp-up and accelerated time-to-market. You will leverage electrical and electro-optical characterization methods, advanced production data correlation, and data analytics to identify root causes of failures, while coordinating yield and reliability improvement activities with cross-functional departments such as Product Engineering, Design, Test, Quality Assurance, R&D Yield Enhancement, and Manufacturing Yield Enhancement. **Key Responsibilities** * Perform electrical and physical failure analysis and optical fault isolation techniques including photon emission, optical probing, and microprobing to replicate probe failures and determine root cause * Leverage Electronic Design Automation tools for circuit understanding, timing characterization, and failure signature analysis while exploring automation and ML/AI-driven solutions to enhance root cause methodologies * Dissect fab and probe data using tools such as ESDA, layout/net tracing, and advanced image analyzers; monitor yields, analyze SWRs/conversions/excursions, and correlate probe data with inline monitors and backend reliability data * Lead weekly teleconferences with remote and US sites to present findings, r
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