Micron Technology
Semiconductor
PrincipalProcessEngineer,DieBonding
Neural analysis suggests this role is
optimal for Senior candidates.
“Principal Process Engineer, Die Bonding at Micron Technology. Skills: Die Bonding Process, Process Development, Yield Improvement. Start up die bonding processes. Develop die bonding processes”
What You'll Achieve.
Improve product quality; Improve product reliability; Improve process yield; Reduce cost; Improve productivity; Achieve quality objectives; Achieve cost objectives; Achieve risk management objectives
Industry & Context.
Problem resolution; Failure analysis; Troubleshooting
What They're Looking For.
Must Have
BS degree, 8+ years experience in Semiconductor Process Engineering, Semiconductor advanced packaging die stacking processes knowledge, Skilled at designing valid tests, Skilled at Design of Experiments (DOE), Excellent data collection skills, Excellent data organization skills, Excellent data analysis skills, Proficiency in data analysis techniques/programs, Excellent oral communication skills, Excellent written communication skills, Attention to detail, Ability to work independently, Ability to work as a group leader, Ability to work as a collaborative contributor, Knowledge of project management, Understanding of project management
Nice to Have
Masters or Doctorate degree in Engineering, Physics, or related field, Experience in Die Bonding: Fusion Bonding, Experience in Die Bonding: Hybrid Bonding, Experience in Die Bonding: Direct Bonding, Experience on MEMS applications, Experience on Imager applications, Experience on Memory applications, Experience on Heterogeneous Integration applications, Bonding experience at a Vendor, Bonding experience at a Research Institute, Bonding experience at a Semiconductor Industry Equipment Supplier, Bonding experience at a Integrator
What You'll Do.
Start up die bonding processes
Develop die bonding processes
Optimize die bonding processes
Improve product quality
Improve product reliability
Improve process yield
Resolve manufacturing line problems
Identify assembly process problems
Diagnose assembly process problems
Resolve assembly process problems
Apply failure analysis
Apply SPC/FDC methodology
Develop die bonding process technologies
Diagnose die bonding process technologies
Resolve die bonding process technologies
Coordinate process evaluation initiatives
Coordinate equipment evaluation initiatives
Coordinate material evaluation initiatives
Execute process evaluation initiatives
Execute equipment evaluation initiatives
Execute material evaluation initiatives
Implement process step changes
Lead yield improvement activities
Lead cost reduction activities
Participate in yield improvement activities
Participate in cost reduction activities
Validate new process baseline
Fan out new process baseline
Qualify new process baseline
Manage material suppliers
Audit material suppliers
Liaise with material suppliers
Achieve supplier quality objectives
Achieve supplier cost objectives
Achieve supplier risk management objectives
Support SPC/FDC/RMS/APC
Support site-to-site portability
Support internal audits
Support external audits
How You'll Work.
Team & Collaboration
Global R&D collaboration; Equipment supplier collaboration; Materials supplier collaboration; Manufacturing teams collaboration
Communication Scope
Oral communication; Written communication
Process & Methodology
Project management
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Principal Process Engineer in Die Bonding, you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement, and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. **Responsibilities:** * Develop, diagnose, and resolve various die bonding process technologies * Coordinate and execute process, equipment, and material evaluation/optimization initiatives and implement changes at process step * Lead and participate in continuous yield improvement and cost reduction activities * Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction * Manage, audit, and be a liaison with material suppliers to achieve quality, cost, and risk ma
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