Micron Technology
Semiconductor
PrincipalPhysicalDesignArchitect,HBM
Neural analysis suggests this role is
optimal for Senior candidates.
“Principal Physical Design Architect, HBM at Micron Technology. Skills: Physical Design, HBM Architecture, Analog Layout, Mixed-signal Layout. Develop floorplans. Optimize circuit placement”
Industry & Context.
Problem-solving skills
What They're Looking For.
Must Have
MS degree with 5+ years memory layout experience, BS degree with 7+ years relevant experience, Cadence VLE/VXL expertise, Mentor Graphics Calibre DRC/LVS expertise, Analog layout fundamentals understanding, Hands-on analog/mixed-signal layout experience, Analytical skills, Problem-solving skills, Collaboration skills
Nice to Have
DRAM, SRAM, or memory-centric physical design experience, Ability to communicate technical concepts, Motivated contributor
What You'll Do.
Optimize circuit placement
Optimize routing efficiency
Optimize power delivery networks
Deliver block-level layouts
Develop analog layouts
Develop mixed-signal layouts
Collaborate with architects
Collaborate with circuit designers
Evaluate timing trade-offs
Evaluate area trade-offs
Evaluate power trade-offs
Evaluate complexity trade-offs
Support circuit integration
Ensure alignment with rules
Ensure alignment with manufacturability
Ensure alignment with verification
Provide design insights
Improve circuit robustness
Improve circuit performance
Improve circuit reliability
Participate in reviews
Fix physical build issues
Fix parasitic extraction issues
Fix full-chip integration issues
How You'll Work.
Team & Collaboration
Architecture teams; Circuit build teams; Layout teams; Design teams; Verification teams
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an HBM Design Architect, you will support the development of advanced analog, mixed‑signal, and digital circuits as well as full‑chip integration for next‑generation High Bandwidth Memory (HBM) products. This role focuses on physical design and layout, including creating optimized floorplans, driving circuit placement and routing strategies, and delivering high‑quality block‑level layouts using advanced process nodes. You will collaborate closely with architecture, circuit build, and layout teams to enable groundbreaking DRAM solutions that push performance, power efficiency, and density for developing HBM technologies. **Responsibilities** * Develop floorplans that optimize circuit placement, routing efficiency, and power delivery networks. * Deliver block‑level analog or mixed‑signal layouts using advanced foundry process technologies. * Collaborate with HBM architects and circuit designers on floorplanning, placement, routing, and integration strategies. * Evaluate timing, area, power, and complexity trade-offs for high‑speed DRAM and mixed‑signal circuits. * Support integration of Memory, Logic, and Analog circuits for new HBM product architectures. * Ensure alignment with developed rules, manufacturability requirements, and physical verification constraints. * Provide design-focused insights to improve circuit robustness, performance, and reliability. * Participate in reviews and fixing issues across physical build, parasitic extraction, and full‑chip integration. **Qualifications** * MS degree with 5+ years of memory‑related layout or physical design experience, or BS degree with 7+ years of relevant experience. * Expertise with Cadence VLE/VXL and Mento
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