PrincipalEUVMaskTechnologyR&DEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron’s Mask Technology Center (MTC), we develop the materials, films, and processes that enable next‑generation EUV lithography. We collaborate across materials science, lithography, OPC, and high‑volume manufacturing to solve some of the most exciting challenges in advanced DRAM scaling. We are a hands‑on, innovative team working on technology that shapes the future of High‑NA EUV. In this role, you will lead R&D for next‑generation EUV mask materials and processes, driving readiness for High‑NA EUV manufacturing. You will guide roadmap strategy, partner with world‑class engineering teams and suppliers, and develop solutions that translate complex lithography requirements into manufacturable, reliable mask technologies. **Responsibilities:** * Lead development of EUV mask blank materials and mask processes, including film stack design, deposition, etch, clean, and patterning quality * Drive High‑NA EUV readiness through material selection, mask design, stitching, lithography performance, and lifetime improvement * Translate lithography requirements into manufacturable mask solutions in partnership with OPC, design, and lithography teams * Lead data‑driven R&D using DOE and fundamental analysis to improve yield, reliability, and manufacturability * Mentor engineers and transition developed technologies to FEOL process engineering teams **Minimum Qualifications:** * MS or PhD in Materials Science, Physics, Chemistry, Chemical Engineering, or related field * Hands‑on experience with EUV mask technology, thin films, materials, or process characterization * Strong problem‑solving skills and demonstrated innovation in semiconductor manufacturing * Ability to comm