PrincipalEUVMaskBEOLR&DEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Mask Technology Center (MTC) team is at the forefront of High‑NA EUV innovation. We work on the industry’s toughest lithography and mask challenges and collaborate across fields to define what next‑generation DRAM manufacturing will look like. We take on complex physics, new materials, and advanced inspection technologies—and we have fun doing it! In this role, you will lead development of EUV mask BEOL technologies that enable Micron’s future roadmap. You’ll own high‑visibility R&D programs, partner closely with suppliers, guide technology choices, and drive readiness for High‑NA EUV manufacturing. This is a hands‑on, high‑impact role for someone who enjoys deep technical exploration, modeling, and mentoring others while shaping long‑term strategy. **Responsibilities:** * Lead R&D for EUV mask BEOL characterization, quality enablement, defect printability rules, and imaging performance * Develop actinic inspection, automated defect classification, printability assessment, metrology, and defect repair processes * Drive physics‑based modeling and lithography simulation to correlate mask properties with wafer performance * Define tool capability requirements, lead early supplier engagement, and guide technology selection * Mentor engineers and transition developed technologies to BEOL process engineering teams **Minimum Qualifications:** * MS or PhD in Physics, Optics, Materials Science, or related field * Experience in EUV or High‑NA EUV mask or wafer technology development * Strong understanding of EUV lithography and mask‑to‑wafer correlation * Hands‑on experience with lithography simulation and mask pattern design * Proven ability to lead sophisticated R&D