Micron Technology

Semiconductor

PrincipalEngineer,HBMDesign-TechnologyEnablement

$275–450k ~AI est. Richardson, Texas, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Principal Engineer, HBM Design-Technology Enablement at Micron Technology. Skills: HBM design, Technology enablement, Design methodology. Define HBM roadmaps. Deliver HBM roadmaps”

What You'll Achieve.

Improve robustness; Improve quality; Improve execution velocity

Industry & Context.

Semiconductor
Problems you'll solve

Root cause analysis

What They're Looking For.

Must Have

BS/MS in Electrical Engineering or related field, 10 years experience, HBM or DRAM design experience, Technology enablement experience, Node-aware methodology experience, Understanding of process-design interactions, Deliver practical methodology solutions, Effective collaboration across organizations

Nice to Have

Experience in DEG, Experience in technology PE, Experience in node development, Familiarity with HBM architecture, Familiarity with system-level constraints, Contribute to cross-site technical alignment

What You'll Do.

Translate scaling challenges

Participate in technical reviews

Participate in technical forums

Act as technical contributor

How You'll Work.

Team & Collaboration

Design teams; Technology Development teams; Product teams; Architecture organizations; Technology organizations

Process & Methodology

Roadmaps

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Engineer to support the HIG‑HBM team with design methodology and technology enablement for next‑generation HBM products. This role focuses on translating process and node‑level constraints into scalable, executable design methodologies that improve robustness, quality, and execution velocity for HBM programs. The position is suited for a senior technical contributor who operates across technology, design, and integration teams, with strong hands‑on influence rather than organization‑wide strategy ownership. **Key Responsibilities** * Partner with Design, Technology Development, and Product teams to define and deliver HBM self-consistent design/product, technology, and packaging roadmaps * Translate HBM scaling challenges, including power, performance, reliability, variability, and manufacturability, to technology and test vehicle requirements * Participate in multi-functional technical reviews and forums related to HBM technology and build tradeoffs * Act as a technical contributor and mentor within the HIG‑HBM organization **Required Qualifications** * Min of 10 years’ experience with a BS/MS in Electrical Engineering or related field (or equivalent experience) * Strong experience in HBM or DRAM design, technology enablement, and node‑aware methodology * Solid understanding of process–design interactions at advanced nodes * Proven ability to deliver practical methodology solutions used by design teams * Effective collaboration across Architecture, design, and technology organizations **Preferred Qualifications** * Prior experience in DEG, technology PE, or node development, adjacent roles * Familiarity with HBM architecture and system‑level constraints

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