Micron Technology

Semiconductor

PrincipalEngineer,ASICPhysicalDesign

$275–450k ~AI est. Minneapolis, Minnesota, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Principal Engineer, ASIC Physical Design at Micron Technology. Skills: ASIC Physical Design, Low-power design, Timing closure, Tape-out. Lead block-level and full-chip physical design. Drive timing closure across multiple modes and corners”

What You'll Achieve.

Successful tape-out across advanced technology nodes

Industry & Context.

Semiconductor
Problems you'll solve

Timing closure; Power integrity; IR signoff; Resolution

What They're Looking For.

Must Have

Bachelor's degree or Master's degree or equivalent experience in Electrical Engineering, Electronics, or Computer Architecture, Minimum of 15 years of hands-on ASIC physical design implementation experience, Proven experience with multiple production tape-outs in advanced process nodes, Expertise in low-power design techniques including UPF/CPF and multi-voltage systems, Proficiency in scripting languages such as Tcl, Perl, or Python for flow automation

Nice to Have

Experience with Synopsys and Cadence physical design and timing tools, Hands-on physical verification closure using Calibre and power integrity analysis tools, Experience with IR signoff and resolution at block and full-chip level, Background in memory tester designs, high-speed interfaces, or microprocessor architectures, Experience developing and enabling APR flows for new technology nodes

What You'll Do.

Lead block-level and full-chip physical design

Drive timing closure across multiple modes and corners

Perform power integrity

and power grid closure

Develop and optimize APR flows

Own subsystem or full-chip closure work

Coordinate with cross-functional teams

How You'll Work.

Team & Collaboration

Cross-functional teams

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Job Summary** This position supports Micron’s DRAM Tester Solutions group, focusing on physical design implementation for processors, controller architectures, and ASICs. The role is responsible for full‑chip and block‑level physical design closure, low‑power implementation, timing, power, and signal integrity signoff, and successful tape‑out across advanced technology nodes. **Responsibilities:** * Lead block‑level and full‑chip physical design including floorplanning, placement, CTS, routing, and tape‑out. * Drive timing closure across multiple modes and corners using industry‑standard STA tools. * Perform power integrity, IR/EM, and power grid closure to meet signoff requirements. * Develop and optimize APR flows, scripts, and methodologies for PPA improvements. * Own subsystem or full-chip closure work while coordinating with cross-functional teams. **Minimum Qualifications:** * Bachelor’s degree or Master’s degree or equivalent experience in Electrical Engineering, Electronics, or Computer Architecture. * Minimum of 15 years of hands‑on ASIC physical design implementation experience. * Proven experience with multiple production tape‑outs in advanced process nodes. * Strong expertise in low‑power design techniques including UPF/CPF and multi‑voltage systems. * Proficiency in scripting languages such as Tcl, Perl, or Python for flow automation. **Preferred Qualifications:** * Experience with Synopsys and Cadence physical design and timing tools. * Hands‑on physical verification closure using Calibre and power integrity analysis tools. * Experience with IR/EM signoff and resolution at block and full‑chip level. * Background in memory tester designs, high‑spee

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