Micron Technology
Semiconductor
PrincipalEngineer,AdvDRAMPI
Neural analysis suggests this role is
optimal for Principal candidates.
“Principal Engineer, Adv DRAM PI at Micron Technology. Skills: DRAM, Process integration, Device physics. Lead technology development and team. Enable vertically stacked dynamic RAM”
What You'll Achieve.
Improve product quality; Improve reliability; Improve manufacturability
Industry & Context.
Root cause analysis; Failure mechanisms
What They're Looking For.
Must Have
MS or PhD in Physics, Materials Science, Electrical Engineering, or related technical field, 5+ years relevant industry experience in semiconductor process integration or development, Functional knowledge of semiconductor device physics and materials science, Proven project management skills with experience leading cross-functional technical teams
Nice to Have
Detailed knowledge of mainstream memory technologies (DRAM, NAND), Experience handling advanced-node projects, Clear vision for team leadership, Expertise in meticulous experiment build, Expertise in theoretical/statistical data analysis
What You'll Do.
Lead technology development and team
Enable vertically stacked dynamic RAM
Focus on charge storage devices
Focus on thin-film transistors
Optimize process flows
Develop creative solutions to improve product quality
Develop creative solutions to improve reliability
Develop creative solutions to improve manufacturability
Collaborate with multi-functional teams
Resolve complex performance issues
Design experiments in R&D fab
Execute experiments in R&D fab
Evaluate process changes
Optimize process changes
Evaluate material changes
Optimize material changes
Analyze parametric data
Diagnose failure mechanisms
Communicate technical findings
Drive team to implement solutions
How You'll Work.
Team & Collaboration
Multi-functional teams; Build teams; Probe teams; Yield improvement teams
Communication Scope
Technical findings
Process & Methodology
Project management
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. You will lead a group of world-class engineers in our industry-leading R&D facility, focusing on the performance and manufacturability of next-generation 3D DRAM. This role bridges the gap between device physics, materials science, and process integration to solve complex scaling, performance, and power challenges. Join an inclusive team where your expertise will fuel innovation in artificial intelligence and virtual reality. **Responsibilities** Lead technology development and a team of engineers to enable the first vertically stacked dynamic RAM, focusing on charge storage devices and thin-film transistors. Optimize process flows and develop creative solutions to improve product quality, reliability, and manufacturability. Collaborate with multi-functional teams, including build, probe, and yield improvement, to resolve complex performance issues. Design and execute experiments in the R&D fab to evaluate and optimize process, equipment, and material changes. Analyze inline, parametric, and probe data to diagnose failure mechanisms using 8D, FMEA, or SPC methodologies. Communicate sophisticated technical findings and drive the team to implement actionable solutions. **Minimum Qualifications** MS or PhD in Physics, Materials Science, Electrical Engineering, or a related technical field. 5+ years of relevant industry experience in semiconductor process integration or development. Strong functional knowledge of semiconductor device physics and materials science. Proven project management skills with experience leading cross-functional technical team
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