PrincipalDesignEngineer,HBM

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! As a **Principal HBM Design Engineer** , you will **lead cross-functional efforts to drive silicon debug, product quality, and system-level stability for high-volume HBM products**. You will own the resolution of complex silicon and system issues, influence design and architectural decisions, and ensure successful deployment across key customer platforms. You will operate at the intersection of **design, silicon, and system behavior** , providing technical leadership across the full product lifecycle and driving continuous improvement into future HBM generations. ## **Responsibilities** * **Design Ownership:** Work on HBM product design and own design health through sustaining phase, driving ECO implementation, verification, and long-term maintainability.**** * **Technical Leadership:** Define debug strategies, guide cross-functional teams, and serve as a technical authority in HBM sustaining efforts. * **Silicon & System Debug:** Lead root-cause analysis and resolution of complex silicon, system, and customer issues, driving closure across multiple domains. * **Cross-Functional Execution:** Drive alignment and execution across DE, PE, TD, and system teams to ensure efficient issue resolution and product delivery. * **Quality & Yield Leadersh