PrincipalAnalogDesignEngineer,HBM

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. **Responsibilities will include, but are not limited to:** * Lead the design and own critical HBM analog circuits, including: * High‑speed transmitters and receivers * Clock generation and distribution (PLLs, DLLs, CDRs) * SerDes‑related analog blocks * Biasing, reference, and calibration circuits * Power delivery and regulation circuits (LDOs, regulators) * Define and lead IP interfaces, power domains, clocking schemes, and reset strategies across subsystems * Perform detailed pre‑layout and post‑layout simulations * Conduct PVT, Monte Carlo, mismatch, and aging analyses * Work closely with layout engineers to define floorplanning and symmetry requirements, ensure matching, shielding, and EM/IR compliance * Review and sign off on analog layouts * Drive layout‑aware build optimizations for advanced nodes * Define guidelines for analog build, documentation, and reuse * Collaborate across analog, digital, system, packaging, and test teams **Minimum Qualifications:** * MS or PhD in Electrical Engineering or related field * ~10–15+ years of experience in analog/mixed-signal IC build Proven expertise in: * High-speed interf