PR,Engineer,FEOCTCPEEADTBOND

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a **Bonding Process & Equipment Engineer at Micron Technology**, you will be part of Micron Central team under ADT, responsible for the startup, development, optimization, and control of wafer leve bonding processes (e.g., hybrid bonding, fusion bonding, temporary bonding). You will drive **yield improvement, cost reduction, process capability enhancement, and risk management** , while resolving complex manufacturing challenges. This role requires collaboration across process integration, equipment engineering, suppliers, and global manufacturing sites. ## **Key Responsibilities** ### **Process Development & Optimization** * Develop, qualify, and optimize bonding process technologies (e.g., hybrid bonding, dielectric bonding, TSV-related integration) * Establish, refine and simplify process conditions, recipes, and operating windows to meet performance and reliability targets * Drive process capability improvement (Cpk) and defect reduction ### **Yield & Reliability Improvement** * Lead yield enhancement initiatives by analyzing process, tool, and material interactions * Perform systematic root cause analysis using methodologies such as **DOE, FMEA, 8D, SPC, and fault isolation techniques** * Evaluate defect modes (voids, misalignment, delamination, corrosion) and implement corrective actions ### **Equipment & Materials Engineering** * Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g., EVG, TEL, Disco platform