OpenAI

semiconductor

PhysicalDesignEngineer,ForwardDeployedEngineering

$162–302k San Francisco, California, United States; United States FULL TIME Remote Friendly
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“Physical Design Engineer, Forward Deployed Engineering at OpenAI. Skills: physical design expertise, Forward Deployed Engineering. Serve as the physical design SME for semiconductor customer engagements. helping FDE teams understand backend implementation workflows, constraints, and opportunities”

What You'll Achieve.

materially improve engineering workflows and accelerate innovation; turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem; raise the quality of our customer-facing technical work; build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice; turn high-touch semiconductor deployments into repeatable solutions; ensuring evals reflect real workflows and meaningful success metrics; validate opportunities and accelerate solution development; so the org can engage customers with greater depth and confidence; help shape roadmap, model behavior, and platform capabilities for semiconductor use cases; ownership of deployment outcomes

Industry & Context.

semiconductor
Problems you'll solve

translate ambiguous pain points into clear solution hypotheses

What They're Looking For.

Must Have

BS with 7+ years, MS with 5+ years, or equivalent industry experience in physical design, physical implementation, or backend signoff for complex ASIC or SoC programs, Demonstrated success bringing complex designs through tapeout, with hands-on experience in floorplanning, place and route, CTS, timing closure, power analysis, physical verification, and signoff, Deep familiarity with industry-standard EDA tools and flows for synthesis, PNR, STA, physical verification, equivalence checking, and power analysis, understanding of how physical design intersects with microarchitecture, RTL, verification, design methodology, libraries/PDKs, and system-level PPA trade-offs, communication and collaboration skills, with the ability to translate deep technical trade-offs clearly in customer-facing and cross-functional settings, Comfortable operating as a consultative expert and advisor — unblocking teams, shaping decisions, and raising technical quality without necessarily being the direct implementation owner, scripting and automation skills in Python, Tcl, or similar, Excited to grow beyond domain SME responsibilities into a broader Forward Deployed Engineering role, including hands-on solution building, customer-facing delivery, and ownership of deployment outcomes

Nice to Have

Experience working across multiple semiconductor companies, design environments, or tool stacks, with a point of view shaped by different engineering cultures and methodologies, Experience partnering with external customers, strategic accounts, or design partners in a technical advisory capacity, Experience defining or scaling evaluation workflows, benchmarks, or acceptance criteria, Exposure to adjacent workflows such as design and/or verification, Experience applying AI/LLM systems to semiconductor workflows, Prior experience in solutions engineering, field engineering, customer-facing technical delivery, or consultative technical roles

What You'll Do.

Serve as the physical design SME for semiconductor customer engagements

helping FDE teams understand backend implementation workflows

Partner with FDEs during customer discovery and scoping to translate ambiguous pain points into clear solution hypotheses

Support customer-facing technical conversations as a trusted advisor

engaging credibly with technical leaders

Help shape AI-assisted solutions across physical design workflows

including floorplanning

physical verification

Guide feasibility and integration decisions across the entire chip design lifecycle: design

Partner with FDEs and customer SMEs to curate evaluation datasets

and acceptance criteria for physical design use cases

ensuring evals reflect real workflows and meaningful success metrics

Build or guide lightweight prototypes

methodology experiments

and internal tools that validate opportunities and accelerate solution development

Educate and mentor the broader FDE team on physical design concepts

Surface repeated customer signal to Product and Research to help shape roadmap

and platform capabilities for semiconductor use cases

Progressively take on broader FDE responsibilities

including customer discovery

solution architecture

prototype development

production deployment

and ownership of technical workstreams

How You'll Work.

Team & Collaboration

partners with leading semiconductor companies; partners with FDEs; Partner with FDEs and customer SMEs; Educate and mentor the broader FDE team; Surface repeated customer signal to Product and Research

Communication Scope

translate deep technical trade-offs clearly in customer-facing and cross-functional settings

Process & Methodology

shaping deployment strategy, driving technical workstreams, ownership of technical workstreams

Full Job Description

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

Free ATS check

Applying for this Physical Design Engineer, Forward Deployed Engineering role?

Most applicants get filtered before a human reads their resume. See if yours makes the cut.

How to Apply on Ashby

  • Ashby is a fast modern ATS — most applications take under 3 minutes.
  • The resume parser is strong; verify parsed experience dates and job titles.
  • Custom screening questions are often scored algorithmically — answer completely.
  • Location field affects geo-based screening; use your actual metro area.

ANONYMOUS · UNFILTERED

What do employees actually say about OpenAI?

Real rants from real employees. Read before you apply.

Read Company Rants →