PackagingEngineer

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. * Participate in the development of package design and advanced substrate layout for products. * Learn and become proficient in EDA layout tools (e.g., Cadence SIP/Allegro) to perform package and substrate drawing, design modifications, and related engineering tasks. * Perform basic routing planning, layer stack‑up configuration, and design‑for‑manufacturability (DFM) checks based on established design rules and manufacturing requirements. * Collaborate with cross‑functional engineering teams—including hardware, manufacturing, and packaging—to support package structure evaluations, design updates, and issue resolution. ## Qualifications Required Qualifications: * Bachelor’s or Master’s degree in Electrical Engineering, Electronics Engineering, Materials Science, Mechanical Engineering, Physics, or other related engineering/science fields. * Coursework, project experience, or internsh