Annapurna Labs
Technology
PackagingEngineer
“Packaging Engineer at Annapurna Labs. Skills: Machine learning chips, Packaging, Assembly technology. Evaluate packaging technology roadmap. Evaluate assembly technology roadmap”
Industry & Context.
analytic and problem-solving skills; solve complex technical problems
What They're Looking For.
Must Have
B. Sc. or M. Sc. degree, 5 years of professional experience
Nice to Have
High communication skills, Dive deep quickly, analytic and problem-solving skills, Ability to work independently, Good understanding of transmission line theory, Good understanding of power delivery, Good understanding of signal integrity, programming and scripting skills in Perl, programming and scripting skills in Python, programming and scripting skills in Tcl, Cadence Skill familiarity, EXCEL familiarity, Enthusiastic, work with a minimum of supervision, Can solve complex technical problems
What You'll Do.
Evaluate packaging technology roadmap
Evaluate assembly technology roadmap
Engage with product architect
Engage with design teams
Explore packaging technologies
Provide recommendations on packaging technologies
Provide recommendations on assembly technologies
Engage with substrate vendors
Engage with assembly vendors
Assume ownership of mechanical performance
Assume ownership of thermal performance
Optimize mechanical tradeoffs
Optimize thermal tradeoffs
Ensure testability of ICs
Define workflows at OSATs
Track assembly yields
Track substrate yields
Improve assembly yields
Improve substrate yields
How You'll Work.
Team & Collaboration
design teams; software engineers; HW Dev team; Test Engineer team
Communication Scope
High communication skills
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