Micron Technology
Technology
PackageSiliconTechnologyNodeDevelopmentDirector/DMTS
Neural analysis suggests this role is
optimal for Director candidates.
“Package Silicon Technology Node Development Director/DMTS at Micron Technology. Skills: Chip-package interaction, Technology roadmaps, Silicon node transitions. Define CPI technology roadmaps. Drive technology strategy”
Industry & Context.
Risk mitigation
What They're Looking For.
Must Have
Master’s or PhD, 15+ years semiconductor technology development, Extensive CPI experience, Extensive electrical failure mechanisms, Extensive physical failure mechanisms, Extensive reliability testing, Extensive qualification methodologies, Extensive screening methodologies, Track record technical innovation, Track record industry contributions
Nice to Have
Knowledge of memory technologies, Knowledge of semiconductor device physics
What You'll Do.
Define CPI technology roadmaps
Drive technology strategy
Manage risk frameworks
Lead global technical initiatives
Ensure silicon readiness
Ensure package readiness
Ensure test vehicle readiness
Partner with Fab Process Integration
Partner with Product Design
Partner with Package Design
Partner with Assembly Technology Development
Partner with Global Quality
Establish risk identification
Establish risk modeling
Establish risk mitigation
Ensure design integration
Ensure process integration
Ensure packaging integration
Align resource planning
Drive execution rigor
Ensure technology readiness
Ensure delivery milestones
Influence decision-making
Serve as subject matter expert
Mentor engineering teams
Guide engineering teams
Foster technical excellence
Participate in strategic discussions
How You'll Work.
Team & Collaboration
Global engineering teams; Cross-functional leadership; Internal stakeholders; External stakeholders
Communication Scope
Presentation skills; Influence technical audiences; Influence executive audiences
Process & Methodology
Program management
Full Job Description
**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. **Director / DMTS – Package Development Engineering (PDE)** **Role Overview** Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Director / Distinguished Member of Technical Staff (DMTS). In this role, you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. You will operate at the intersection of silicon, package, and system-level integration, ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes. This is a high-impact, cross-functional leadership role, requiring close collaboration with global engineering teams spanning Fab Process Integration, Product Development, Package Design, Assembly Technology Development, and Global Quality. You will play a critical role in shaping future memory product success through technology innovation, risk management, and execution excellence. **Key Responsibilities** **Technical Leadership & Strategy ** • Define, develop, and maintain long-term chip-package interaction (CPI) technology roadmaps aligned with advanced silicon node transitions •Drive technology strategy and risk management frameworks to support future memory product launches • Lead global technical initiatives to ensure alignment between silicon, package, and test vehicle readiness **Cross-Functional Collaboration** • Pa
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