Micron Technology
Semiconductor
PackageHealth-StaffEngineer,AdvancedPackagingTechnologyDevelopment
Neural analysis suggests this role is
optimal for Senior candidates.
“Package Health - Staff Engineer, Advanced Packaging Technology Development at Micron Technology. Skills: Advanced packaging, Package health, Reliability testing. Develop DFT strategies. Implement DFT strategies”
Industry & Context.
Problem-solving skills
What They're Looking For.
Must Have
Bachelor’s or Master’s degree, 6+ years of experience in semiconductor industry, Hands-on experience with simulation tools, Hands-on experience with test equipment, Experience working on package characterization, Experience with reliability testing, Experience with electrical failure analysis, Proficiency in statistics, Proficiency in data analysis, Proficiency in scripting, Good knowledge of semiconductor packaging process, Good knowledge of material interaction, Good knowledge of material properties, Good knowledge of DRAM product testing, Good knowledge of ASIC product testing, Good knowledge of test architecture, Good knowledge of packaging fail modes
Nice to Have
Experience with AI/ML tools, Experience with statistical modeling, Familiarity with JEDEC standards, Familiarity with other reliability standards
What You'll Do.
Develop DFT strategies
Implement DFT strategies
Perform characterization
Identify indicators of degradation
Collaborate with data scientists
Build predictive models
Support root cause analysis
Support corrective actions
How You'll Work.
Team & Collaboration
Collaborate with data scientists
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Job Summary** The Package Health Engineer will contribute to the development and execution of package health monitoring, simulation, and characterization activities. This role involves hands-on engineering work in DFT, data analysis, and reliability testing to ensure robust packaging solutions. **Key Responsibilities** * Develop and implement DFT strategies for advanced packaging. * Conduct simulations for mechanical, thermal, and electrical performance. * Perform electrical and mechanical characterization of packages. * Analyze test and field data to identify early indicators of package degradation. * Collaborate with data scientists to build predictive models for package health. * Support root cause analysis and corrective actions for reliability issues. **Qualifications** * Bachelor’s or Master’s degree in Electrical Engineering, Materials Science, or related field. * 6+ years of experience in semiconductor industry (complex products preferred), preferably in packaging, test, or reliability engineering. * Hands-on experience with simulation tools and test equipment, working on package characterization, reliability testing or electrical failure analysis. * Proficiency in statistics, data analysis and scripting (e.g., Python, MATLAB, JMP). * Good knowledge of semiconductor packaging process, material interaction and properties. * Good knowledge of DRAM or ASIC product testing, test architecture, and packaging fail modes. **Additional/Preferred Qualifications** * Experience with AI/ML tools or statistical modeling. * Familiarity with JEDEC or other reliability standards. * Strong problem-solving and documentation skills **About Micron Technology, Inc.** We are
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