Absolics Inc.

Semiconductor Packaging

NPIProcessEngineer

$85–115k Covington, Georgia, United States FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid+ candidates.

The Brief

“NPI Process Engineer at Absolics Inc.. Skills: NPI Process Engineering, Semiconductor Packaging, Product Launch, Reliability Testing. Own new Glass Core Substrate product development. Define product specifications”

What You'll Achieve.

Accelerate product development; Accelerate customer launch programs; Successful product launch; Successful completion of qualification

Industry & Context.

Semiconductor Packaging
Problems you'll solve

Resolve development issues; Identify reliability risks; Drive mitigations

What They're Looking For.

Must Have

Must be 18 years of age or older, Legally authorized to work in the United States, Proficiency in MS Office: Excel, Word, PowerPoint, Outlook, Advanced substrate process experience, OSAT packaging experience, Hands-on process engineering experience, Product analysis experience, Experience taking product from development through customer qualification, Experience taking product through commercial launch, Working understanding of reliability concepts, Failure modes knowledge, Stress testing principles knowledge, Design and process decisions impact knowledge

Nice to Have

Experience developing product roadmaps, Experience contributing to product roadmaps, Familiarity with DFM concepts, Background in failure analysis, Exposure to quality certification frameworks, Understanding of reliability test standards, Experience with DOE, Experience with statistical analysis tools, Automotive-grade product experience, Familiarity with AEC-Q100 requirements, Korean language proficiency

What You'll Do.

Own new Glass Core Substrate product development

Define product specifications

Drive internal development builds

Shepherd product through qualification

Shepherd product into volume production

Work with CAM to confirm manufacturability

Work with process engineering to confirm manufacturability

Lead internal development builds

Define build objectives

Coordinate with manufacturing teams

Coordinate with process teams

Evaluate build results

Drive iterative improvement toward spec

Perform product analysis

Coordinate product analysis

Characterize new products

Resolve development issues

Coordinate test execution

Review reliability test results

Interpret reliability test results

Prepare qualification summary reports

Identify reliability risks

Drive mitigations before qualification

Own qualification documentation

Manage handoff to production team

How You'll Work.

Team & Collaboration

Customer engineering teams; Internal development teams; Manufacturing teams; Process teams; Internal test resources; External test resources; Cross-functional teams; Korea HQ engineering teams

Communication Scope

Presenting to customers; Presenting to leadership; Technical writing

Process & Methodology

Product roadmap coordination, Qualification documentation management, Handoff management

Full Job Description

Company Description Absolics Inc. is a U.S.-based subsidiary of SKC Co., Ltd., pioneering the commercialization of Glass Core Substrates (GCS) for next-generation semiconductor packaging. Our Covington, GA facility is the center of our U. S. NPI and manufacturing operations, developing glass substrate solutions for AI accelerators, HPC SoCs, and advanced chiplet architectures. We are growing our NPI team to accelerate product development and customer launch programs with tier-1 fabless and OSAT customers. Job Title: NPI Process Engineer Location: Covington, GA Job Type: Full-Time Position Summary: The NPI Engineer owns new Glass Core Substrate product development from initial customer engagement through product launch. Working closely with customer engineering teams, this role defines product specifications, drives internal development and sample builds, and shepherds the product through qualification and into volume production. We are looking for someone who has been on the floor — who understands how materials and processes behave, knows how to read a failure, and has sat across the table from a customer to close out a product launch. Substrate manufacturer background is the strongest fit; OSAT packaging engineering experience is also well-suited for this role. Responsibilities work with CAM and process engineering to confirm manufacturability. Lead internal development builds: define build objectives, coordinate with manufacturing and process teams, evaluate results, and drive iterative improvement toward spec. Perform or coordinate product analysis (cross-section, electrical, dimensional, surface) to characterize new products and resolve development issues. Product Roadmap coordinate test execution with internal and external test resources. Review and interpret reliability test results (HAST, TCT, bending, electrical characterization, etc.); prepare qualification summary reports for customer and internal review. Identify reliability risks early in the developmen

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