NewCollegeGrad-MixedSignalDesignEngineer,HBM

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Micron’s Memory Systems Engineering team and contribute to the development of premier digital and mixed-signal foundations for our high-bandwidth memory (HBM) products. This position offers an outstanding chance to work intimately with multiple engineering areas, guaranteeing the smooth integration and implementation of HBM base die. Join a motivated team committed to delivering robust first-pass silicon that meets our strict bandwidth, latency, power, and reliability objectives! ## Responsibilities * Assist in defining and carrying out digital micro-architecture for HBM base-die subsystems, covering channel support logic, boot and initialization sequencing, training orchestration, configuration and status registers, telemetry, performance counters, and reliability features. * Translate system requirements into timing, power, and area considerations by partnering with physical layer and system architects, and help maintain interface specifications for bus protocols, clock-domain crossings, and reset strategies. * Implement and integrate synthesizable SystemVerilog RTL, including multi-channel logic, interrupts, events, register maps, scan hooks, and design-for-test interfaces, while supporting clean integration and ECO flows. * Collaborate with design verification teams to support verification planning, coverage goals, CDC/RDC checks, and debugging of RTL, testbench, and gate-level issues. * Support silicon bring-up and post-silicon validation through debug enablement, issue correlation to RTL or architecture, and collaboration with DFT and test teams. ## Minimum Qualifications * Bachelor’s degree or equivalent experience in Electrical Engineering or Compute