Micron Technology

Technology

MTSHIG-HBM-LAYOUT

₹60–90L ~AI est. Hyderabad, India FULL TIME
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Senior candidates.

The Brief

“MTS HIG-HBM-LAYOUT at Micron Technology. Skills: Layout execution, Full-chip integration, Team leadership. Lead layout execution. Own full-chip technical decisions”

What You'll Achieve.

Meet schedule commitments; Meet quality expectations; Ensure closure with documentation; Ensure closure with audits

Industry & Context.

Technology
Problems you'll solve

Technical decisions; Performance optimization; Power optimization; Area optimization

What They're Looking For.

Must Have

18+ years analog/custom layout, Advanced CMOS process experience, Minimum 4+ years developing teams, Minimum 4+ years project experience, Experience leading multiple projects, Experience with multiple Tape-outs, Expertise in Cadence VLE/VXL, Expertise in Calibre DRC/LVS, Layout skills, Floor planning skills, Manual routing skills, Ability to build analog/mixed-signal layout team, Ability to continuously develop layout team, Experienced running custom IC layout projects, Excellent verbal communication skills, Excellent written communication skills, Capable of working in multi-functional team, Capable of working in multi-site team, Capable of working in multiple time zones

Nice to Have

AI/automation adoption experience

What You'll Do.

Lead layout execution

Own full-chip technical decisions

Drive project planning

Drive project execution

Ensure timely delivery

Perform layout verification

Oversee layout verification

Guide junior engineers

Conduct design reviews

Enable capability development

Drive productivity improvements

Improve turnaround time

Collaborate with global teams

Support customer needs

Support product integration needs

Contribute to organizational growth

Contribute to leadership initiatives

Represent Micron in industry

How You'll Work.

Team & Collaboration

Global cross-functional teams; Design teams; Verification teams; IP teams; Packaging teams; Multi-functional teams; Multi-site teams; Multiple time zones

Communication Scope

Verbal communication; Written communication

Process & Methodology

Project planning, Area estimation, Time estimation, Scheduling, Task delegation, Milestone tracking, Multiple concurrent programs, Multiple project management, Tape-out management

Full Job Description

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. **Role and Responsibilities** * **Lead end-to-end layout execution** of analog, mixed-signal, custom digital blocks and full-chip integration for HBM products. * **Own full-chip technical decisions** covering analog, digital, memory, ESD, EM/IR and ensure optimal performance, power, and area (PPA). * **Technical Expertise** : Hands-on experience in layout design of critical Memory /Analog and mixed-signal blocks such as: Array Layout, Decoder, Control logic , IOs , PLLs , ADCs, DACs, LDOs, Bandgaps, Reference Generators, Charge Pumps, Current Mirrors, Comparators, and Differential Amplifiers. * **Drive project planning and execution** , including area/time estimation, scheduling, task delegation, and milestone tracking across multiple concurrent programs. * **Ensure timely delivery with quality** , responsible for block-level and full-chip layouts meeting schedule commitments and quality expectations. * **Perform and oversee layout verification activities** including LVS, DRC, Antenna checks, and ensure closure with proper documentation and audits. * **Lead and mentor the layout team** , guiding junior engineers on sub-block execution, conducting design reviews, and enabling capability development. * **Drive innovation and productivity improvements** , including adoption of AI/automation to reduce layout effort, improve turnaround time, and enhance quality. * **Collaborate with global cross-functional teams** (Design, Verification, IP, Packaging) and ensure strong communication for project alignment and success. * **Support customer and product integration needs** , including specification alignment, design clarifications, and successful implementation of Micron

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