Samsung Austin Semiconductor
Semiconductor
ModuleIntegrationEngineer
Neural analysis suggests this role is
optimal for Senior candidates.
“Module Integration Engineer at Samsung Austin Semiconductor. Skills: Module Integration, GAA Technology, Process Integration, Device Physics. Execute FEOL module setup plan. Monitor line performance”
What You'll Achieve.
Meet aggressive qualification timeline; Satisfy process capabilities; Drive high volume manufacturing (HVM) product qualification; Drive yield ramp-up; Drive performance target achievement
Industry & Context.
Resolve systematic yield challenges; Resolve performance challenges; Resolve reliability challenges
All positions at Samsung Austin Semiconductor require you to be onsite, May require access to information subject to U.S. export control laws, Applicants must be authorized to access such information or eligible for government authorization, Agree not to disclose to Samsung—or encourage Samsung to use—any confidential or proprietary information
What They're Looking For.
Must Have
Master’s or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field, Minimum 8 years of experience on advanced node FinFet or GAA technology, Front End of Line (FEOL) module process integration engineering experience, Device physics knowledge, Knowledge of unit processes such as: lithography, dry / wet etch, CMP, diffusion, implant, thin‑film deposition, and metrology, Expertise in Design of Experiments (DOE), Experience leading projects, Experience serving as a Task Force Team (TFT) lead, Capable of shifting focus and changing priorities, Ability to meet deadlines multiple priorities, Interpersonal skills, Ability to influence, motivate, and align diverse stakeholders, Excellent written and verbal communication skills, Willing to work and learn in a fast-paced, cross‑functional, multicultural team environment, Authorized to access U.S. export control information or eligible for government authorization
Nice to Have
Gate-All-Around (GAA) Source & Drain module integration engineering experience, Hands-on work in FinFET or Gate‑All‑Around (GAA) devices
What You'll Do.
Execute FEOL module setup plan
Monitor line performance
Intervene on off target SPC excursions
Develop improvement plans
Lead engineering projects
Lead Task Force Teams (TFTs)
Resolve systematic yield challenges
Resolve performance challenges
Resolve reliability challenges
Perform feasibility studies
Create design of experiments (DOE)
Produce written reports
Deliver oral presentations
How You'll Work.
Team & Collaboration
Working closely with Process Architect (PA); Working closely with Process Integration Engineering (PIE); Working closely with Fab Engineering (FE) units; Working closely with Device & SRAM integration; Working closely with DFM; Working closely with manufacturing teams; Align diverse stakeholders
Communication Scope
Excellent written and verbal communication skills; Deliver oral presentations
Process & Methodology
Lead engineering projects, Lead Task Force Teams (TFTs)
Full Job Description
**About Samsung Austin Semiconductor** Samsung is a world leader in advanced semiconductor technology, founded on the belief that the pursuit of excellence creates a better world. At SAS, we are Innovating Today to Power the Devices of Tomorrow. **Come innovate with us!** **Position Summary** Seeking a senior individual contributor with hands on experience in module process integration for advanced Gate All Around (GAA) technologies. The Module Integration Engineering (MIE) team drives new technology transfer, establishes process integration route, and enhances process margin, performance, yield, and reliability. In this role you will perform 2 nm GAA source & Drain (SD) module integration projects, working closely with Process Architect (PA), Process Integration Engineering (PIE), Fab Engineering (FE) units, Device & SRAM integration, DFM, and manufacturing teams. **Role and Responsibilities** **Here’s What You’ll Be Responsible For:** * Execute the Front End of Line (FEOL) module setup plan—particularly the Source & Drain (SD) module—with minimal supervision to meet the aggressive qualification timeline. * Monitor line performance, intervene on off target SPC excursions, and develop improvement plans that satisfy process capabilities. * Lead engineering projects that drive high volume manufacturing (HVM) product qualification, yield ramp‑up, and performance target achievement. * Lead Task Force Teams (TFTs) to resolve systematic yield, performance, or reliability challenges. * Perform feasibility studies and create design of experiments (DOE) for performance and yield improvement throughout the product development cycle. * Produce written reports and deliver oral presentations for internal management and external partners. **Skills and Qualifications** **Here 's what you'll need:** * Master’s or PhD degree in Electrical Engineering, Physics, Materials Science, or a closely related field. * Minimum 8 years of experience on advanced node FinFet or GAA technology. *
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