Teledyne Imaging Sensors
Aerospace and Defense
MicroelectronicsTechnician(2ndShift)
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Microelectronics Technician (2nd Shift) at Teledyne Imaging Sensors. Skills: Microelectronics fabrication. Perform diamond fly cutting of wafers. Perform diamond fly cutting of sensor chips”
Industry & Context.
2nd Shift
What They're Looking For.
Must Have
Ability to perform assembly tasks using a microscope, Understanding of metric and English measuring systems, High School Diploma with 8-15 years of experience, Associate's Degree with 5-10 years of experience, Experience in microelectronic device fabrication, Must be a U. S. Citizen
What You'll Do.
Perform diamond fly cutting of wafers
Perform diamond fly cutting of sensor chips
Clean sensor chip assemblies
Measure sensor chip assemblies
Inspect sensor chip assemblies
Document nonconforming events during cleaning
Document nonconforming events during inspection
Evaluate parts in accordance with quality assurance requirements
How You'll Work.
Team & Collaboration
Mission-focused team
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** **Join Teledyne Imaging Sensors as a Microelectronics Technician (2nd Shift)!** Are you ready to launch your career to the next level? Join our mission-focused team, where we value technical excellence, collaboration, and agility. We’re the world’s leading provider of infrared sensors for space, with customers like NASA, ESA, and the US Department of Defense. **What You’ll Do:** · Perform diamond fly cutting of wafers and sensor chips. · Clean, measure, and inspect sensor chip assemblies. · Documents nonconforming events during cleaning or inspection. · Evaluate parts in accordance with quality assurance requirements. **What You Need:** · Ability to perform assembly tasks using a microscope. · Understanding of metric and English measuring systems. · Proficiency with Microsoft Project, Office Suite, and Excel. · Skills to operate complicated equipment like hybridizers, optical inspection systems, etchers, etc. · High School Diploma with 8-15 years of experience or Associate's Degree with 5-10 years of experience · Experience in microelectronic device fabrication. · Must be a U.S. Citizen due to access restrictions. **What We Offer:** · Competitive Salary & Benefits Package · Health, Dental, Vision, and Life Insurance from Day 1 · Paid Vacation, Sick Time, and Holidays · 401(k) with Company Match · Employee Stock Purchase Plan · Educational Tuition Reimbursement · Fun Employee Events throughout the year **
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