Northrop Grumman
Space Technology
MicroelectronicsPackagingEngineer(Level3/4)
“Microelectronics Packaging Engineer (Level 3/4) at Northrop Grumman. Skills: mechanical design, analysis, integration, testing, micro-circuit design, space sensor payload hardware. mechanical development of advanced micro-circuit design as well as the assemblies that they support. development of microcircuit advancements that are funded by internal NGC IRAD”
What You'll Achieve.
assure cost, schedule and technical performance is achieved
Industry & Context.
Troubleshoot or support technicians in troubleshooting issues with hardware designs during integration and test and provide suggestions for improvement and optimization; developing root cause and corrective actions
RELOCATION ASSISTANCE: Relocation assistance may be available, CLEARANCE REQUIRED FOR START: No, CLEARANCE TYPE: SCI, TRAVEL: Yes, 10% of the Time, Ability to obtain and maintain a TS/SCI security clearance with Poly, United States Citizenship
What They're Looking For.
Must Have
B. S degree in a STEM field with 5 years of engineering or a Master’s degree in STEM and 3 years of engineering experience (Level 3), B. S degree in a STEM field with 8 years of engineering Master’s degree in STEM and 6 years of engineering experience, or a Ph. D. and 3 years of experience (Level 4), Experience presenting complex technical programs and concepts to non-technical and technical personnel and customers, Ability to successfully read and interpret schematics, block diagrams, sketches, oral and written instructions, manufacturer's specifications/operation manuals, and analyze hardware configurations, Ability to work independently and collaborate as part of a cross-functional team with other engineers, management, and contractors, Minimum 2 years of experience with mechanical design and analysis AutoCAD and/or other 3D CAD software packages, Ability to obtain and maintain a TS/SCI security clearance with Poly, United States Citizenship
Nice to Have
Active TS/SCI clearance with Poly, Minimum 2 years of mechanical micro-circuit design experience, Experience with printed circuit board fabrication and testing, Experience with surface mount technology, including process steps to manufacture and test micro-circuits, Demonstrated technical design support of mechanical microcircuit design, Ability to collaborate with multi-disciplinary teams, Able to work in a fast-paced environment where multiple projects are being developed and deployed simultaneously
What You'll Do.
mechanical development of advanced micro-circuit design as well as the assemblies that they support
development of microcircuit advancements that are funded by internal NGC IRAD
understanding of all aspects of hardware development
understanding technical performance of mechanical requirements of space program microcircuit hardware or subsystems
understanding the integration and test process of space hardware and the special tooling that may be required
research and develop procedures
and tools for further the development of micro-circuit technology
support program meetings in developing root cause and corrective actions
troubleshoot or support technicians in troubleshooting issues with hardware designs during integration and test and provide suggestions for improvement and optimization
verify space micro-circuit designs and performance by making necessary calculations
How You'll Work.
Team & Collaboration
collaborate as part of a cross-functional team with other engineers, management, and contractors; collaborate with multi-disciplinary teams; Facilitate knowledge sharing and mentoring
Communication Scope
Experience presenting complex technical programs and concepts to non-technical and technical personnel and customers
Process & Methodology
lead or support department initiatives, technology roadmap creation, NCTA project leadership
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