Anduril Industries

Defense Technology

Micro-electronicsTechnician-2ndShift

$75–105k ~AI est. Hudson, New Hampshire, United States
Market Sentiment
HIGH DEMAND

Neural analysis suggests this role is
optimal for Mid+ candidates.

The Brief

“Micro-electronics Technician - 2nd Shift at Anduril Industries. Skills: Wire bonding, Microelectronic assembly, Quality inspection. Execute complex wire bonding operations. Operate wire bonding equipment”

What You'll Achieve.

Meet highest standards of quality; Meet highest standards of performance; Meet highest standards of reliability

Industry & Context.

Defense Technology
Problems you'll solve

Troubleshooting; Root cause analysis

Eligibility Requirements

Second shift work, Access to export controlled information

What They're Looking For.

Must Have

High School Diploma or equivalent, Hands-on wire bonding experience, Microelectronic manufacturing experience, Technical bootcamp or certification, Proficiency in wire bonding techniques, Proficiency in microelectronic assembly, Precise adhesive and epoxy application, Exceptional manual dexterity, Ability to work under microscope, Read and interpret technical documentation, Maintain clean, safe, ESD-compliant environment, U.S. Person status

Nice to Have

Experience with Westbond equipment

What You'll Do.

Execute complex wire bonding operations

Operate wire bonding equipment

Maintain wire bonding equipment

Perform gold ball bonding

Perform wedge bonding

Perform ribbon bonding

Perform alloy bonding

Perform manganin wire bonding

Bond onto various substrates

Perform microelectronic assembly

Integrate micro-electronic components

Interpret Interface Control Documents

Interpret engineering drawings

Perform equipment setup

Perform equipment calibration

Make minor adjustments to machinery

Optimize bonding parameters

Conduct in-process inspections

Conduct final inspections

Ensure compliance with specifications

Identify technical problems

Analyze technical problems

Resolve technical problems

Contribute to process improvements

Optimize process parameters

Meet high standards for quality

Meet high standards for consistency

Meet high standards for work rate

Adhere to cleanroom protocols

Adhere to safety guidelines

Adhere to ESD procedures

How You'll Work.

Team & Collaboration

Work with technicians; Work with engineers

Full Job Description

Anduril Industries is a defense technology company with a mission to transform U. S. and allied military capabilities with advanced technology. By bringing the expertise, technology, and business model of the 21st century’s most innovative companies to the defense industry, Anduril is changing how military systems are designed, built and sold. Anduril’s family of systems is powered by Lattice OS, an AI-powered operating system that turns thousands of data streams into a realtime, 3D command and control center. As the world enters an era of strategic competition, Anduril is committed to bringing cutting-edge autonomy, AI, computer vision, sensor fusion, and networking technology to the military in months, not years. About the Role Join Anduril Industries' AIRS team, a leader in the design and manufacture of high-performance cooled infrared cameras and components. As a Micro-electronics Technician, you will play a crucial role in the production of these cutting-edge electronic components, directly contributing to the expansion of Anduril's advanced sensing systems. We are seeking a meticulous and skilled individual with demonstrated expertise in wire bonding and microelectronic assembly processes. The ideal candidate will ensure that our products consistently meet the highest standards of quality, performance, and reliability. Note: This role is dedicated to second shift. Approximate work hours are 3-4PM start time to 11 PM to Midnight end time. WHAT YOU'LL DO: Execute Complex Wire Bonding Operations: Operate and maintain a variety of wire bonding equipment, including manual, semi-automatic, and automated bonders (e.g., Westbond), to perform precise gold ball, wedge, ribbon, alloy, and manganin wire bonding (e.g., 0.001" diameter) onto various substrates such as duroid and ceramic, capacitors, resistors, diodes, and spirals. Perform Microelectronic Assembly: Conduct intricate assembly tasks, including the careful mixing and application of various adhesives, glues, and

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