Tenstorrent
AI technology
MechanicalEngineer
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Mechanical Engineer at Tenstorrent. Skills: Mechanical simulations, Semiconductor packages, Stress analysis, Thermal behavior. Perform mechanical simulations. Predict stress, strain, thermal behavior”
What You'll Achieve.
Improve manufacturability; Improve reliability; Improve overall package performance; Shape package design decisions; Shape product performance; Shape readiness for production
Industry & Context.
Solving hard problems
Eligibility to access U.S. export-controlled technology, Compliance with U.S. export laws (EAR), Citizenship/permanent residency status or ability to obtain prior license approval
What They're Looking For.
Must Have
Degree in Mechanical Engineering, Materials Science, or a related field, Experience in semiconductor package simulation, Expertise in stress analysis, Expertise in thermal behavior, Expertise in mechanical modeling for complex package structures, Proficient with FEA tools, Solid foundation in core mechanical engineering principles, Work independently, Build models from scratch, Gather input across teams, Communicate technical findings clearly to stakeholders
Nice to Have
Experience with ANSYS, Experience with Abaqus
What You'll Do.
Perform mechanical simulations
Conduct warpage prediction
Mechanical optimization
Analyze package design options
Validate package designs
Document simulation results
Present simulation results
How You'll Work.
Team & Collaboration
Gather input across teams; Collaborate with design, process, and reliability teams; Communicate technical findings clearly to stakeholders; Work cross-functionally with experts
Communication Scope
Communicate technical findings clearly to stakeholders
Full Job Description
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are seeking a Mechanical Engineer to join our team, specializing in mechanical simulations for semiconductor packages. The ideal candidate will have a background in predicting stress and mechanical behavior across various layers of both advanced 2.5D and standard semiconductor packages. You will be a part of a high-impact high-visibility team, and you will learn about all aspects of AI hardware development, from architecture to design to manufacturing, to reliability. This role is hybrid, based out of Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are You hold a degree in Mechanical Engineering, Materials Science, or a related field and have experience in semiconductor package simulation. You bring strong expertise in stress analysis, thermal behavior, and mechanical modeling for complex package structures. You are proficient with FEA tools such as ANSYS, Abaqus, or similar platforms, with a solid foundation in core mechanical engineering principles. You work independently, build models from scratch, gather input across teams, and communicate technical findings clearly to stakeholders. What we need Perform mechanical simulations to pred
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