Teledyne Micropac
Microelectronics Manufacturing
LeanManufacturingEngineer
Neural analysis suggests this role is
optimal for Mid candidates.
“Lean Manufacturing Engineer at Teledyne Micropac. Skills: Lean Manufacturing, Six Sigma, structured problem-solving methods, microelectronics manufacturing processes. Develop, modify, and optimize manufacturing processes from engineering handoff through full-scale production. Provide hands-on technical leadership for critical microelectronics processes”
What You'll Achieve.
process stability; yield improvement; scrap reduction; production readiness; eliminate waste; improve execution; monitor yield, rework, scrap, cycle time, and production readiness
Industry & Context.
structured problem-solving methods; Analyze process and test data; failure analysis support
What They're Looking For.
Must Have
Associate's degree in engineering (Mechanical, Electrical, Materials, Industrial, or related discipline), 7-8 years of experience in manufacturing engineering, process development, or continuous improvement, Hands-on experience with microelectronics or high-reliability manufacturing processes such as wire bonding, die attach, hermetic sealing, welding, or precision assembly, cross-functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams, Ability to manage multiple technical initiatives, track actions and risks, and drive timely closure
Nice to Have
Lean Six Sigma Green Belt or similar certification, Working knowledge of Lean, Six Sigma, standard work, and yield improvement methodologies, Experience in aerospace, defense, medical, or other regulated manufacturing environments, Experience using ERP/MRP systems
What You'll Do.
and optimize manufacturing processes from engineering handoff through full-scale production
Provide hands-on technical leadership for critical microelectronics processes
Lead and facilitate DFM reviews
Analyze process and test data to define operating limits
and control parameters
Plan and execute DoEs
equipment capability studies
and support the introduction of new tools
and automation technologies
Support reliability engineering activities
Lead and support continuous improvement initiatives focused on yield
and process stability
and structured problem-solving methods to eliminate waste and improve execution
Support organization KPIs to monitor yield
and production readiness
Coordinate cross-functional efforts for new product introductions
and process improvement projects
Ensure engineering documentation accurately reflects shop-floor execution and drives execution discipline
How You'll Work.
Team & Collaboration
partner closely with engineering, quality, and manufacturing teams; Lead and facilitate DFM reviews, ensuring early and effective collaboration between design engineering and manufacturing; Coordinate cross-functional efforts for new product introductions, engineering changes, and process improvement projects; cross-functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams
Communication Scope
cross-functional communication skills with the ability to coordinate engineering, quality, and manufacturing teams
Process & Methodology
Ability to manage multiple technical initiatives, track actions and risks, and drive timely closure
Full Job Description
**Be visionary** Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. **Job Description** Teledyne Micropac is looking for a Lean Manufacturing Engineer who will provide hands‑on technical leadership to develop, optimize, and sustain high‑reliability microelectronics manufacturing processes from engineering handoff through full‑scale production. This role focuses on process stability, yield improvement, scrap reduction, and production readiness by applying Lean, Six Sigma, and structured problem‑solving methods. This role will partner closely with engineering, quality, and manufacturing teams to support new product introductions, process changes, and continuous improvement initiatives while ensuring shop‑floor execution aligns with documented standards and KPIs. **What you 'll do** The essential functions and key responsibilities for the position include, but are not limited to: * Develop, modify, and optimize manufacturing processes from engineering handoff through full‑scale production. * Provide hands‑on technical leadership for critical microelectronics processes, including wire bond, epoxy die attach, hermetic sealing, welding, lid attach, leak testing, and assembly. * Lead and facilitate DFM reviews, ensuring early and effective collaboration between design engineering and manufacturing. * Analyze process and test data to define operating limits, specifications, and control parameters. * Plan and execute DoEs, equipment capability studies, and support the introduction of new tools, fixt
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