Amazon Kuiper Manufacturing Enterprises LLC
Technology
LeadPhysicalDesignEngineer
Neural analysis suggests this role is
optimal for Lead candidates.
“Lead Physical Design Engineer at Amazon Kuiper Manufacturing Enterprises LLC. Skills: Physical Design, SOC Implementation, Wireless Communications. Lead physical design activities. Interface and select 3rd party vendor”
Industry & Context.
Root cause analysis
U. S. citizen or national, U. S. permanent resident, Lawfully admitted refugee, Granted asylum
What They're Looking For.
Must Have
8+ years ASIC implementation, 8+ years digital design, 8+ years wireless communications, Bachelor's degree in Electrical Engineering, Knowledge of chips with multiple power islands, Knowledge of serial protocols, Experience low power design techniques
Nice to Have
Master's degree or Ph.D., Experience with modern ASIC/FPGA design, Experience with SOC bring-up, Experience with post-silicon validation
What You'll Do.
Lead physical design activities
Interface and select 3rd party vendor
Manage execution of physical design work
Close feedback loop with RTL team
Implement complex designs
Facilitate PPA analysis
Review and analyze IP blocks
Review and analyze physical design teams
Review and analyze DFT coverage
Identify performance limits and improvements
Interface with 3rd party design team
Audit and improve checklists
Audit and improve flows
Build physical design capability
Hire physical design engineers
How You'll Work.
Team & Collaboration
Work closely with Architects; Work closely with RTL Designers; Work closely with Designers
Full Job Description
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world. Lead physical design activities for the Modem SOC. Interface and select 3rd party physical design vendor. Manage execution of physical design work. Close the feedback loop with RTL team based on physical design considerations. Implement complex designs in the targeted technology node. Key job responsibilities Work closely with Architects, and RTL Designers to facilitate PPA analysis for technology node selection. Review and analyze technology specific 3rd party IP blocks for performance, supported collateral, and other KPI Review and analyze current and future 3rd party physical design teams to ensure high quality partnership. Review and analyze DFT coverage to ensure project and product requirements are met. Work closely with Architects and Designers to identify performance limits and improvements. Interface with the current 3rd party physical design team. Audit and improve existing checklists and flows. Build world class physical design capability through mentoring and hiring. This team will be capable of taking a design through floorplanning all the way to chip finishing. Export Control Requirement: Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum. A day in the life Be part of Amazon LEO’s sub-team responsible for defining and implementing the digital chip SOCs for communications via Low Earth Orbit satellites and Amazon gateways. This is a unique opportunity to define the highest quality wireless solution with few legacy constraints. The team works with customer requirements and wireless system teams to define modems, high-speed interfaces, embedded processors, and DSP solutions in la
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