Intern-ProductIntegrationEngineer(PIE)YE

**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. •**Project Title:** Technical Investigation of 3D‑NAND Physical Failure Analysis Workflows for Automation and AI Implementation Opportunities •**Project Description:** •Physical Failure Analysis (PFA) of 3D‑NAND flash memory plays a critical role in enabling yield ramp, reliability qualification, and customer failure resolution. Compared to traditional planar devices, 3D‑NAND PFA inherently exhibits longer and more variable cycle time due to its vertically stacked architecture, extreme aspect‑ratio features, and strong dependence on accurate failure localization. PFA cycle time is not merely a lab efficiency metric; it directly impacts yield‑learning speed during technology ramp, effectiveness of corrective actions, and response time for customer returns and reliability excursions. Understanding and addressing the technical sources of PFA cycle‑time inflation is therefore essential for advanced NAND manufacturing. –In this project, the student will analyze the end‑to‑end PFA workflow for 3D‑NAND devices to identify cycle‑time bottlenecks, complexity drivers, and sources of variability. Based on this analysis, the project will define targeted automation and AI implementation opportunities to improve lab efficiency, reduce turnaround time, and enhance analysis consistency. –The student will receive on‑the‑job training in PFA concepts and techniques and will work closely with experienced engineers and mentors to apply analytical thinking and solving skills to real manuf