HBMSoCRTLDesignEngineer

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. **Key Responsibilities** * Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. * Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). * Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. * Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. * Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. * Contribute to design documentation, block specifications, and design reviews. * Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. **Minimum Qualifications** * Bachelor’s or master’s degree in electrical engineering, Computer Engineering, or a related field, with a minimum of 10 years of experience in a related field. * Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies. * Experience with