Micron Technology
Semiconductor
HBMProductEngineer
Neural analysis suggests this role is
optimal for Mid+ candidates.
“HBM Product Engineer at Micron Technology. Skills: HBM products, Layout optimization, Product qualification. Design test structures. Analyze test structures”
What You'll Achieve.
Product qualification; Yield improvement
Industry & Context.
Failure analysis; Resistance extraction; Design rule verification
What They're Looking For.
Must Have
PhD in Electrical and Computer Engineering, PhD in Thermal and Semiconductor Processing, Data Analysis, Layout and Design Rule check, 3D integration, Semiconductor process, Thermal simulation
What You'll Do.
Design test structures
Analyze test structures
Validate test structures
Optimize thermal reliability
Optimize electrical reliability
Optimize mechanical reliability
Perform failure analysis
Perform resistance extraction
Perform design rule verification
Lead layout optimization
Co-design with package teams
Co-design with die teams
Create test structures
Analyze product layout features
How You'll Work.
Team & Collaboration
Cross-functional teams; Design teams; Process engineering; Package engineering
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Design, analyze, and validate test structures and layout for advanced HBM (High Bandwidth Memory) products. Collaborate with cross-functional teams including design, process, and package engineering to optimize thermal, electrical, and mechanical reliability. Perform failure analysis, resistance extraction, and design rule verification using tools such as Cadence Virtuoso, Calibre, and scripting languages. Lead efforts in layout optimization and co-design with package and die teams for product qualification and yield improvement. Create test structures, test chip development, design rule development and product layout feature analysis for chip package interactions. Employer will accept a Ph.D. in Electrical and Computer Engineering, Thermal and Semiconductor Processing or related fields. Position also requires: 1\. Data Analysis 2\. Layout and Design Rule check 3\. 3D integration 4\. Semiconductor process 5\. Thermal simulation As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on _[micro
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