Micron Technology
Technology
HBMEQUIPMENTENGINEER
Neural analysis suggests this role is
optimal for Mid+ candidates.
“HBM EQUIPMENT ENGINEER at Micron Technology. Skills: Manufacturing processes, Equipment procurement, Process implementation. Evaluate manufacturing processes. Improve manufacturing processes”
Industry & Context.
Root cause analysis
What They're Looking For.
Must Have
2 years work experience, Ability to handle thinning or dicing tool, Understand tool installation, setup and buyoff
Nice to Have
Understand tool signal, Understand to handle FDC analysis
What You'll Do.
Evaluate manufacturing processes
Improve manufacturing processes
Coordinate equipment procurement
Coordinate material procurement
Implement new process
Maintain process knowledge
Maintain equipment knowledge
Maintain materials knowledge
Optimize process variables
Optimize equipment variables
Identify process variables
Perform containment deviations
Implement corrective action
Design equipment components
Improve equipment capability
Evaluate future process technologies
Evaluate future equipment technologies
Evaluate future material technologies
Evaluate technology advancements
Research technical information
Build supplier relationships
Maintain supplier relationships
Identify supplier materials
Identify supplier equipment
Create decision matrix
Evaluate tooling material
How You'll Work.
Team & Collaboration
Global team communication; Supplier communication
Communication Scope
Communicate with supplier; Communicate with global team
Full Job Description
**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 職務說明 As a HBM Equipment Engineer, you will be responsible for evaluating and improving manufacturing processes, coordinate equipment/material procurement and qualify and implement new process. Requirements: · Ability to handle the thinning or dicing tool -steal dicing, laser groove, NCF lamination · Understand the tool installation, setup and buyoff · Work experience: 2 years · Understand the tool signal is prefer, such as SVID, CEID, ECID...etc · Understand to handle the FDC analysis and improve is prefer · English: ability to communicate for discussion with supplier and global team Responsibilities and Tasks: Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment · Maintain General process knowledge · Maintain Equipment knowledge as it relates to the process · Maintain Materials knowledge as it relates to the process · Optimize process, equipment variables · Identify all process variables · Understand DOE/FMEA/OCAP/8D/SPC/Repair/PM (preventive) techniques · Perform containment of process and equipment deviations · Determine root cause · Implement corrective action · Design equipment components (Improve equipment capability by exploring new ideas/concepts and implement on equipment) · Maintain knowledge of equipment and materials and how they interact · Evaluate Future Process, Equipment, Material Technologies · Evaluate pertinent technology and engineering advancements relating to equipment, materials and processes · Locate and research technical information on equipment, materials, and/or processes in journals, literature, web, etc · Build and maintain effective relationships with suppliers · Identify supplier’s materials o
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