HBMDesignEngineeringLead-MTS/SMTS/DMTS

**Our vision is to transform how the world uses information to enrich life for _all_. ** Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. You will help shape next-generation High Bandwidth Memory solutions for artificial intelligence and accelerated computing. You will serve as a senior technical contributor and technical project leader, guiding work from architecture definition through silicon bring-up and post-silicon support. You will partner across design, process, packaging, and product teams to deliver reliable silicon with broad business impact. You will influence future memory architectures while mentoring engineers and improving design execution. Job Description ### Responsibilities will include, but are not limited to: * Own and deliver critical High Bandwidth Memory (HBM) design blocks and subsystems from architectural definition through schematic, implementation, verification, tape-out, and post-silicon debug. * Drive robust, high-performance designs by balancing performance, power, reliability, yield, and manufacturability trade-offs. * Lead root-cause analysis and resolution of complex pre-silicon and post-silicon issues across circuit design, architecture, process integration, and packaging interactions. * Serve as technical project lead for one or more HBM programs, coordinating execution across architecture, layout, verification, validation, process integration, packaging, test, and product engineering teams. * Define and communicate technical strategy, priorities, and execution plans while proactively identifying risks, dependencies, and schedule impacts. * Research, develop, and influence next-generation HBM architectures aligned with artificial intelligence, machine learning, and high-performance computing workloads. * Apply deep knowledge of Dynamic Random-Access Memory (DRAM)