HardwareDevelopmentEngineer,AWSCQC

The Amazon Web Services (AWS) Center for Quantum Computing in Pasadena, CA, is looking to hire a Hardware Development Engineer with experience in semiconductor process development – and in particular wirebonding, flip chip bonding, dicing – who will aid in AWS’s effort to bring cloud quantum computing services to its worldwide customer base. Through your work inside and outside of the cleanroom environment in the device fabrication group, you will solve problems related to the fabrication and characterization of novel quantum processors. Key job responsibilities Responsibilities include developing, improving and sustaining fabrication and packaging processes; analyzing inline metrology and electrical test data; interacting with project leads to provide feedback that continuously improves the process. Candidates must have a demonstrated background in solid engineering principles, and must have superlative data analysis, problem solving, and communication skills. Successful candidates will have experience in dicing, wire-bonding, flip chip bonding techniques and tools. Working effectively within a team environment is critical. A day in the life The schedule is late afternoon through late night for this role, 5pm-2am for example. The initial training will be performed in the day time. Once the training is finished, the candidate is expected to work independently in the assigned hours. The candidate will spend most of the time in a cleanroom environment, in a protective suit performing hands-on packaging tasks using IC packaging equipment. The candidate will carry out packaging steps for quantum computing product chips, as well as for development projects. Export Control Requirement Due to applicable export control laws and regulations, candidates must be either a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum, or be able to obtain a US export license. If you are unsu