Sandisk
Computer Hardware
[FRESHGRADONLY-SEPT2026INTAKE]Engineer,MemoryTestDevelopmentEngineering
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“[FRESH GRAD ONLY - SEPT 2026 INTAKE] Engineer, Memory Test Development Engineering at Sandisk. Skills: Memory Test Development Engineering, 3D NAND test solution design, R&D and MP program development, Test Equipment bring-up and correlation, Product-specific flow creation, R&D activities from pre-silicon to post-silicon, Engineering investigation and resolution, Failure analysis, Yield enhancement, Test time optimization, Programming in Java, Bash, Python, C#, and C/C++. 3D NAND test solution d”
What You'll Achieve.
Meet HVM requirements; Yield enhancement; Test time optimization; Screen coverage improvements
Industry & Context.
Engineering investigation and resolution on design/process/packaging issues; RMA failure mode analysis; Problem-solving skills
What They're Looking For.
Must Have
Master’s / Bachelor’s degree in Electronics or Computer Engineering / equivalent, Solid programming foundation with at least one or more of the following programming languages: Java, Bash, Python, C#, and C/C++, Self-motivated and self-directed, Able to achieve results in a fast-moving, dynamic environment, Able to work well with people as a team player, both inside and outside the reporting team, Able to work on a tight project schedule with minimal supervision, Able to multitask and meet deadlines, Able to communicate effectively (written and verbal) with good interpersonal skills
Nice to Have
Proactive with a CAN-DO attitude, able to accept new knowledge in a short time, A sense of teamwork, customer orientation, quality, and discipline is highly preferred, Excellent leadership, communication (written and verbal), planning, organizational, and problem-solving skills
What You'll Do.
3D NAND test solution design
R&D and MP program development on multiple platforms including Advantest T5773
& In house designed platforms.
Test Equipment bring-up and correlation for new packages
pin & channel mapping.
Product-specific flow creation and integration to meet HVM requirements.
R&D activities from pre-silicon to post-silicon
including Design Validation
Engineering Evaluation
Qualification Support
and Failure Analysis.
Engineering investigation and resolution on design/process/packaging issues.
RMA failure mode analysis and screen coverage improvements.
Test data correlation between platforms.
Yield enhancement and test time optimization.
In-house designed platform and new test equipment validation
production environment setup.
How You'll Work.
Team & Collaboration
Collaboration internally across multiple departments, such as PE, Device, Packaging, and Design, as well as with external ATE vendors and related parties for debugging and related engineering activities.
Communication Scope
Communication (written and verbal); Interpersonal skills; Excellent communication (written and verbal)
Process & Methodology
Project management, Able to work on a tight project schedule with minimal supervision, Able to multitask and meet deadlines, Planning, Organizational skills
Full Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ESSENTIAL DUTIES AND RESPONSIBILITIES: * 3D NAND test solution design, assessment, development, and maintenance, including hardware, software, and data analysis. * R&D and MP program development on multiple platforms including Advantest T5773, T5831 series, & In house designed platforms. * Test Equipment bring-up and correlation for new packages, including DSA design, pin & channel mapping. * Product-specific flow creation and integration to meet HVM requirements. * R&D activities from pre-silicon to post-silicon, including Design Validation, Engineering Evaluation, Qualification Support, and Failure Analysis. * Engineering investigation and resolution on design/process/packaging issues. * RMA failure mode analysis and screen coverage improvements. * Test data correlation between platforms. Yield enhancement and test time optimization. * Collaboration internally across multiple depar
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