ExperiencedPCBDesignEngineer

- Extract S-parameters (Touchstone format) and RLC ladder models from design data using electromagnetic analysis tools (Ansys HFSS and SIwave) - Perform simulations with a sim tool (Synopsys HSPICE) - Design board (.brd) and package (.mcm) data using a design tool (Cadense Allegro)- Create schematics using Cadense OrCAD (optional) ## Qualifications - Hands-on expertise with Ansys HFSS, Ansys SIwave, and Synopsys HSPICE - Strong understanding of: Signal Integrity (SI); and Power Integrity (PI) - High-speed interconnect modeling - Ability to interpret design data and convert it into meaningful electrical models - Experience with Cadence Allegro for board and package design - Familiarity with .brd and .mcm file formats - Experience with Cadence OrCAD schematic capture -Strong problem solving mindset and ability to work in fast-paced environment. -Good communication skills, ability to cooperate with other teams. - Ability to communicate in Japanese is a plus. ## Additional Information We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning. Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier.’ As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power. With a diverse team of over 21,000 professionals in more than 30 countries, we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and