The Boeing Company
Space
EntryLevel,Associate,orMidLevelElectronicsDesignandAnalysisEngineer(ElectronicPackagingDesign)
“Entry-Level, Associate, or Mid-Level Electronics Design and Analysis Engineer (Electronic Packaging Design) at The Boeing Company. Skills: Electronics Packaging, Mechanical PCB design, Thermal Analysis, Structural Analysis, Vibration Analysis, Computer-Aided Design (CAD). Develop and understand requirements and develop high-level and detailed designs consistent with those requirements. Perform trade studies to optimize structure and meet program requirements”
What You'll Achieve.
Ensure electronics packaging solutions meet the rigorous demands of the space environment; Deliver solutions at the highest level of excellence; Meet program requirements; Show compliance with Boeing, customer and regulatory requirements; Reduce cycle time and drive product improvements; Ensure compliance with requirements
Industry & Context.
Conducts Root Cause and Corrective Action to investigate failures and go-forward plans
Ability to obtain a US Security Clearance, US Citizenship required for Security Clearance, A final U. S. Secret Clearance Post-Start is required, U. S. Person as defined by 22 C. F. R. §120.62 is required, Employer will not sponsor applicants for employment visa status
What They're Looking For.
Must Have
Ability to obtain a US Security Clearance for which the US Government requires US Citizenship as a condition of employment, A final U. S. Secret Clearance Post-Start is required, Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science, Experience using Computer-Aided Design (CAD) tools, Experience with thermal, structural, dynamics, and/or vibration analysis and tools, Experience with Printed Circuit Boards (PCB) design or assembly
Nice to Have
An active Top Secret /SCI clearance, Experience within aerospace or related industry or with space electronics, Experience with ANSYS analysis, Experience with Creo CAD, Experience with SolidWorks, Experience with Finite Element Analysis (FEA), Experience with Siemens NX Nastran, Experience with MSC Patran, Experience with COMSOL Multiphysics, Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers, Skill and ability to collect, organize, synthesize, and analyze summarize develop conclusions and recommendations from appropriate data sources, Experience leading teams on complex projects, Level 1: Education/experience typically acquired through advanced technical education from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), computer science, engineering data science, mathematics, physics, or chemistry (e. g. Bachelor), or an equivalent combination of technical education and experience, Level 2: 2 or more years' related work experience or an equivalent combination of technical education and experience, Level 3: 5 or more years' related work experience or an equivalent combination of technical education and experience
What You'll Do.
Develop and understand requirements and develop high-level and detailed designs consistent with those requirements
Perform trade studies to optimize structure and meet program requirements
Performs detailed structural and thermal analysis using hand calculations and analysis tools
Documents structural analyses and data
required to show compliance with Boeing
customer and regulatory requirements
Collaborate with Electrical Engineering team to perform sizing and placement studies
as well as layout and route printed circuit boards (PCBs)
Validates designs through various methods of review
deploys and supports new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements
Conducts Root Cause and Corrective Action to investigate failures and go-forward plans
tracks and statuses technical performance measures to measure progress and ensure compliance with requirements
Supports Supplier Management with make-buy recommendations and other technical services of limited scope
Investigates emerging technologies to develop concepts for future product designs to meet projected requirements
How You'll Work.
Team & Collaboration
Coordinate with multi-discipline groups to develop and understand requirements; Collaborate with Electrical Engineering team; Seamless collaboration with satellite engineers; Working closely with experts in the field
Communication Scope
Excellent oral and written communication skills; Ability to communicate across multiple disciplines with internal and external customers
Applying for this Entry-Level, Associate, or Mid-Level Electronics Design and Analysis Engineer (Electronic Packaging Design) role?
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