Analog Devices
Semiconductor
Engineer,SemiPackagingEngineering
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Engineer, Semi Packaging Engineering at Analog Devices. Skills: Semiconductor packaging, Systems level packaging, Heterogeneous integration. Design advanced systems level packaging solutions. Develop advanced systems level packaging solutions”
Industry & Context.
Analytical skills; Problem-solving skills; Root cause analysis
10% travel
What They're Looking For.
Must Have
Master’s degree in engineering, 2 to 5 years industrial experience, Experience with OSATs, substrates, EMS partners, Understanding of advanced semiconductor packages, Familiarity with design controls, Familiarity with process development tools, Familiarity with statistical data analysis, Educational background in materials fundamentals, Ability to apply materials knowledge in mechanical design, Experience with 3D CAD tools, Demonstrate engineering aptitude, Demonstrate exceptional communication skills
Nice to Have
Exposure to regulated manufacturing environment
What You'll Do.
Design advanced systems level packaging solutions
Develop advanced systems level packaging solutions
Lead assembly process developments
Engineer new materials
Engineer new processes
Engineer new assembly capabilities
Own manufacturing engineering activities
Collaborate with QA teams
Collaborate with Reliability teams
Drive root cause analysis
Drive yield improvements
Define package architecture
Define DFM/DFX requirements
Define qualification strategies
Benchmark industry best practices
Evaluate emerging technologies
Collate information with supporting data
Present information into report
How You'll Work.
Team & Collaboration
Cross-functional design teams; OSAT partners; ODM partners; EMS partners; Material suppliers; Global manufacturing vendors; Global engineering teams; Operations teams; Supplier teams; Executive teams
Communication Scope
Communicate complex technical concepts
Full Job Description
**About Analog Devices** Analog Devices, Inc. (NASDAQ: [_ADI_](https://finance.yahoo.com/quote/ADI/?ltr=1)) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into solutions that combat climate change, reliably connect humans and the world, and help drive advancements in automation and robotics, mobility, healthcare, energy and data centers. With revenue of more than $11 billion in FY25, ADI ensures today's innovators stay Ahead of What's Possible. Learn more at [_www.analog.com_](https://www.analog.com/en.html) and on [_LinkedIn_](https://www.linkedin.com/company/analog-devices) and [_X_](https://x.com/ADI_News). We are seeking a highly motivated Systems Semiconductor Packaging Engineer to join a multidisciplinary team developing advanced semiconductor modules and systems level solutions for Healthcare, Industrial, New Energy, Robotics and Physical AI applications. This role will drive product realization from concept through manufacturing by working closely with cross-functional design teams, OSAT, ODM and EMS partners, material suppliers and global manufacturing vendors across multiple time zones. The ideal candidate should have 2 - 5 years of experience in semiconductor packaging, system integration, manufacturing process development and reliability engineering. Potential candidate is expected to: * Work closely with cross-functional teams to design and develop advanced systems level packaging solutions including heterogeneous packaging solutions, multi-chip modules, sensor packages and high-density interconnect assemblies. * Lead assembly process developments to support Digital Health Care, Medical Devices, Industrial, Robotics and Physical AI applications. Adheres to strict documentation practices in a regulated environment and owns design control processes. Engineer new materials, processes and assembly capabilities to suit t
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