Sandisk
Computer Hardware
Engineer,PackagingEngineering(ThermalDesign)
Neural analysis suggests this role is
optimal for mid candidates.
“Engineer, Packaging Engineering (Thermal Design) at Sandisk. Skills: Thermal Design, Packaging Engineering, CFD Modeling. Work in Packaging R&D. thermal designs”
What You'll Achieve.
release products on schedule
Industry & Context.
analytical analysis; numerical analysis
What They're Looking For.
Must Have
B. S. in Mechanical Engineering, 5 years of relevant industry experience, Mechanical design, engineering drafting standards, tolerance analysis, plastic injection molding, metal fabrication, work ethic, working with outside suppliers, working with contract manufacturers, Ability to work in a team environment, interact with others to release products on schedule
Nice to Have
mechanical design with electronic consumer product design, retail packaging design
What You'll Do.
Work in Packaging R&D
semiconductor packaging level
flash product PCBA level
thermal modeling (CFD)
validation of flash products PCBA
analytical/numerical analysis
measurement techniques
solutions to meet increased demands
small form factor packages
constrained physical environments
constrained thermal environments
How You'll Work.
Team & Collaboration
interact with others to release products on schedule; Ability to work in a team environment
Communication Scope
oral communication skills; written communication skills
Full Job Description
Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ESSENTIAL DUTIES AND RESPONSIBILITIES: * As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. * The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. * The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments. ## Qualifications REQUIRED: * B.S. in Mechanical Engineering plus 5 years, of relevant industry experience * Solid knowledge through academic coursework or experience required in Mechanical design * Proficiency in CAD software (e.g. SolidWorks, Autocad) * Knowledge of engineering drafting standards and tolerance analysis * A strong backgrou
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