One Thing
ENGINEER,PACKAGEDEVELOPMENTENGINEERING,PACKAGESILICONINTEGRATION
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“ENGINEER, PACKAGE DEVELOPMENT ENGINEERING, PACKAGE SILICON INTEGRATION at One Thing. Skills: Package development, Silicon integration, Memory products. Support CPI assessments. Collect data”
Industry & Context.
Structured problem-solving; Data analysis; Technical problem analysis
What They're Looking For.
Must Have
Bachelor's or Master's degree in Engineering, < 2 years of relevant experience, Semiconductor manufacturing and/or packaging concepts, Structured problem-solving methods, Follow defined engineering procedures, Analyze straightforward technical problems, Learn from feedback, Attention to detail, Willingness to learn new tools, Basic proficiency in Microsoft Excel, Basic proficiency in Microsoft Word, Basic proficiency in Microsoft PowerPoint, Good written communication skills, Good verbal communication skills, Collaborate effectively in a team environment
What You'll Do.
Support CPI assessments
Perform basic analysis
Assist package design engineers
Assist scribe design engineers
Assist assembly engineers
Investigate wafer dicing
Investigate singulation
Investigate integration topics
Participate in DFMEA activities
Participate in PFMEA activities
Review DFMEA risk items
Track DFMEA action items
Support yield investigations
Support quality investigations
Support manufacturability investigations
Support execution of test vehicles
Support execution of DOEs
Learn package development flows
Learn silicon development flows
Learn change-management processes
Prepare technical documentation
Prepare presentation materials
Escalate technical issues
Escalate technical risks
Seek guidance on problems
How You'll Work.
Team & Collaboration
Experienced engineers; Silicon design teams; Wafer fabrication teams; Package design teams; Assembly teams; Wafer fab teams; R&D teams; Manufacturing teams
Communication Scope
Written communication; Verbal communication; Technical documentation; Presentation materials
Full Job Description
**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. # Engineer Package–Silicon Integration # As an **Engineer, Package–Silicon Integration** in Micron’s **Package Development Engineering (PDE)** organization, you will begin your career as a technical contributor supporting NAND package and silicon integration for next‑generation memory products. In this role, you will work closely with experienced engineers across silicon design, wafer fabrication, package design, and assembly teams to learn Micron’s technology development processes, contribute to defined engineering tasks, and support execution of package–silicon integration activities. You will operate with close guidance and mentoring, building foundational technical skills while contributing to team objectives. This position is designed for early‑career engineers and provides structured exposure to semiconductor packaging, integration risks, and cross‑functional collaboration within a high‑volume manufacturing environment. ## Key Responsibilities * Support **chip‑package interaction (CPI)** assessments by collecting data, performing basic analysis, and documenting results under guidance from senior engineers. * Assist package design, scribe design, and assembly engineers in investigating wafer dicing, singulation, and integration topics. * Participate in **DFMEA / PFMEA** activities by helping prepare inputs, reviewing risk items, and tracking action items. * Work with wafer fab, R&D, and manufacturing teams to support yield, quality, and manufacturability issue i
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