Micron Technology Inc.
Semiconductor
Engineer,NANDPI
Neural analysis suggests this role is
optimal for Mid+ candidates.
“Engineer, NAND PI at Micron Technology Inc.. Skills: Process Integration, 3D NAND, Yield Improvement. Lead process modules. Define structural specifications”
What You'll Achieve.
Improve next-generation 3D NAND Product Yield; Improve Quality; Achieve competitive cost; Achieve competitive performance; Meet required timeline
Industry & Context.
Problem-solving; Issue resolution; Root cause analysis
What They're Looking For.
Must Have
Bachelors or Masters or PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science or a related field, Experience in R&D and technology transfer within Semiconductor industry, Committed to quality, collaboration, and continuous improvement, Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment
Nice to Have
Proficiency in scripting/programming/engineering business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable, Ability to develop a holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms, Basic understanding and knowledge and direct experience with non-volatile memories (NAND) along with good understanding of the NAND process flow, the interaction of process & device, common yield & reliability issues are desirable
What You'll Do.
Define structural specifications
Define process requirements
Set strategic direction for module
Develop continual improvement plan
Identify potential issues
Address issues with process control
Solve problems with model-based approach
Focus on structural development
Focus on electrical performance
Focus on parametric verification
Focus on process control
Focus on manufacturability assessment
Select new material for development
Drive material changes from research into production
Design device experiments
Design process experiments
Implement device experiments
Implement process experiments
Perform process development
Perform process integration
Extract experiment data
Analyze experiment data
Report experiment data
Draw conclusions on experiments
Clarify statistical significance of data
Provide team leadership in module development
Assemble development team
Coordinate development team
Make key decisions for team
Provide clear direction for team
Provide goals for team
Provide metrics for team success
Innovate to address complex problems
Develop new technologies
Generate patent disclosures
Coordinate reticle tapeouts
Coordinate flow changes
Coordinate traveler changes
Coordinate lot management
Support technology transfer
Communicate key information via presentations
Communicate projects via presentations
Communicate key information via group discussion
Communicate projects via group discussion
Continually grow technical skills
Continually grow management skills
Pursue continued education via on-job training
Pursue continued education via training class
How You'll Work.
Team & Collaboration
Multi-functional teams; Development team coordination
Communication Scope
Presentations; Group discussion
Full Job Description
**Our vision is to transform how the world uses information to enrich life for all.** Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a NAND Module Process Integration Engineer in the Singapore R&D department at Micron Technology Inc., you will be responsible for designing, developing, integrating, and implementing innovative and effective process solutions to improve next-generation 3D NAND Product Yield and Quality with competitive cost and performance within the required timeline. **Your responsibilities will include, but are not limited to, the following:** * **Module Ownership** : Lead one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit. * **Specification definition** : Define structural specifications and process requirements for assigned modules. * **Strategic Direction:** Set a clear direction and vision for the module and have a well-defined continual improvement plan. * **Proactive Issue Resolution:** Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control. Solve problems with a model-based approach. * **Performance Optimization:** Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization. * **Material Innovation:** Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive material changes from research into production. * **Design Experiments** : Design and implement device and process exp
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